面向ATLAS Phase-Ⅱ升级部分探测器前端电子学测试平台的研究

发布时间：2018-01-11 12:20

  本文关键词：面向ATLAS Phase-Ⅱ升级部分探测器前端电子学测试平台的研究　出处：《中国科学技术大学》2017年博士论文　论文类型：学位论文

  更多相关文章： 探测器前端电子学 高压CMOS像素探测器 像素探测器束流测试 商用ADC耐辐照性能测试

【摘要】：位于瑞士和法国交界处的大型强子对撞机(LHC)作为目前世界上最大的粒子对撞机,自从2008年开始运行以来取得了许多重大的科研成果,如发现了希格斯玻色子等。由于LHC中各个探测器在运行中不断受到辐照损伤,以及预计的对撞亮度的提升将使得其事例数超出目前其探测器的电子学系统的处理能力,LHC总共规划Phase-0至Phase-2三次重大的升级与更新计划。本论文工作主要为LHC超环面仪器实验(ATLAS)探测器的液氩量能器与像素探测器的Phase-Ⅱ升级相关的部分前端电子学测试平台研究工作。内部探测器的升级作为ATLAS探测器Phase-Ⅱ升级最重要的内容之一,其将可能会使用高压CMOS工艺作为其传感器工艺之一,相应的预研工作正在紧密的进行。为了验证这种工艺能够在探测效率和抗辐照损伤这些重要参数上是否满足像素探测器Phase-Ⅱ升级的需求,必然要对其进行大量的电子学测试和束流测试工作以验证其可靠性。面向此测试需求,本论文设计了一个模块化的,基于为ATLAS升级研究的通用前端数据采集系统"前端链路交换系统"(Front-End LInk eXchang,FELIX)的一个像素探测器束流测试平台。目前该像素探测器束流测试系统已于2015年11月正式开始使用,完成了多款AMS(Austria Mikro Systeme)180nm工艺的像素探测器原型芯片的束流测试工作,确定了其辐照前后的探测效率与时间响应等重要参数。且从2016年9月开始应用于AMS 350nm工艺的像素探测器验证芯片的束流测试工作。液氩量能器部分将在Phase-Ⅱ升级中使用全新的前端电子学板(FEB-2),耐辐照ADC的研究为设计制造FEB-2工作的重要工作组成部分。在进行相应耐辐照ADC专用集成电路(ASIC)芯片设计的同时,需要选择一些能够通过辐照测试验证的商用ADC作为其备份芯片。针对商用ADC耐辐照性能测试这一需求,设计了一套用于多通道高速ADC耐辐照性能测试的测试平台。目前该ADC耐辐照性能测试平台已经用于第一批候选的商用多通道ADC,德州仪器公司的ADS52J90与ADI公司的AD9249的耐辐照性能测试工作。其中总剂量效应测试在美国布鲁克海文国家实验室的固态伽玛辐照设施中进行,辐照源为一个活度为700居里的60Co伽玛源,测试时的辐照剂量率约为1OKRad(Si)每小时;单粒子效应测试在美国麻省总医院内用于肿瘤治疗的质子治疗中心中进行,用于进行辐照测试的质子能量为216MeV。辐照测试结果验证了该ADC耐辐照性能测试平台的通用性与可靠性,首次确定了这两片商用ADC的耐辐照性能指标。此外,液氩量能器合作组在Phase-Ⅱ升级计划中提出了一种将所有FEB-2将要使用的电子学模块(如前放、ADC等)集成到一块芯片"前端片上系统"(Front-End System on Chip,FE-SOC)上的构想。目前FE-SOC的各个模块的预研工作正在各个研究单位同时进行,其中前放成形电路部分的原型ASIC有BNL研制的8通道前放成形芯片HLC1,以及法国Omega/LAL组研制的8通道前放ASIC芯片LAUROC。针对这两种多通道前放成型ASIC的测试需求,设计了一个通用的可以对这两种前放ASIC芯片进行电子学以及耐辐照性能测试的测试平台。对该平台的测试结果表明,其能够满足LAUROC芯片以及HLC1芯片的电子学以及耐辐照性能测试的需求。本论文的创新点表现在以下几方面:1)设计了一套能够同时运行与配置待测待测像素探测器、对像素探测器读出芯片(FE-I4B)进行控制与读出、且同时对整个束流测试Telescope的6个IBL双芯片像素探测器模块进行数据读出的像素探测器束流测试平台。为ATLAS探测器Phase-Ⅱ升级中可能使用的高压CMOS像素探测器提供了测试手段。使用这套束流测试系统,ATLAS像素探测器合作组首次确定了使用AMS公司180nm高压CMOS工艺设计的AMS180Vx系列小尺寸像素探测器原型芯片的探测效率等重要参数,直接推动了使用该工艺进行全尺寸验证芯片的研究工作。2)像素探测器束流测试平台使用了 ATLAS升级将使用的通用前端数据采集方案"前端链路交换系统"(Front-End LInk exchange,FELIX)作为其数据采集方案,将束流测试系统的数据带宽上限从以往的千兆以太网级别或者USB通讯级别直接提升到了 100Gbps(24Links × 4.8Gbps)级别。3)针对ATLAS探测器Phase-Ⅱ升级中液氩量能器部分前端电子学读出板的抗辐照需求,设计了一个多通道ADC耐辐照性能测试平台。使用此平台测试了两款新型商用多通道ADC:德州仪器公司的ADS52J90与ADI公司的AD9249的抗辐照性能。
[Abstract]:The Large Hadron Collider in Switzerland and France at the junction (LHC) as the world's largest particle collider, since the beginning of operation in 2008 has achieved many significant achievements in scientific research, such as discovery of the Higgs boson. Because each detector in LHC continuous irradiation damage in operation, and is expected to improve the brightness of the collision will the number of cases beyond the current capacity of the detector electronics system processing, LHC Phase-0 to Phase-2 planning a total of three major upgrade plan. The main work of this thesis is LHC toroidal instrument (ATLAS) Phase- detector of liquid argon calorimeter and pixel detector II upgrade the relevant part of the front-end electronics test the platform of research work. The internal detector ATLAS detector Phase- II upgrade upgrade as one of the most important content, it will probably use high voltage CMOS process As one of the sensor technology, the corresponding research work is closely. In order to verify this process can in the detection efficiency and anti radiation damage meets the pixel detector Phase- II needs to upgrade these important parameters, necessary to carry out a large number of electronics test and beam test to verify the reliability of the test for the demand. In this paper, we design a modular, universal front-end data acquisition system for ATLAS upgrade of front-end link exchange system based on "(Front-End LInk eXchang, FELIX) of a pixel detector beam test platform. The pixel detector beam test system has been started in November 2015, completed a variety of AMS (Austria Mikro Systeme) pixel detector prototype chip 180nm process the beam test, to determine the detection efficiency and the time before and after irradiation. The important parameters should be started. And the pixel detector is applied to AMS 350nm chip verification process of the beam test work from September 2016. The liquid argon calorimeter will use part of the front-end electronics board in new Phase- II upgrade (FEB-2), an important work of radiation resistant ADC for the design and manufacture of FEB-2 work in part. The corresponding radiation resistant ADC application specific integrated circuit (ASIC) chip design at the same time, to choose some through the irradiation test to verify the commercial ADC chip as its backup. Radiation resistance test the demand for commercial ADC, a test platform to test the performance of resistance to irradiation for multi channel high speed ADC is designed. The tolerance of ADC irradiation performance test platform has been used in commercial multi-channel ADC the first candidate, radiation resistance test of ADS52J90 and ADI, TI, AD9249. The total dose effect Solid gamma irradiation facility in the United States Brook Brookhaven National Laboratory tests, radiation source 60Co a gamma source activity was 700 Curie, when testing the radiation dose rate is about 1OKRad (Si) per hour; single particle effect testing in the United States in the Massachusetts General Hospital for proton therapy center in tumor therapy used for testing the proton irradiation, energy verified the versatility and reliability of the ADC radiation resistance test platform for 216MeV. irradiation test results, for the first time to determine the index radiation resistance of these two pieces of commercial ADC. In addition, the amount of liquid argon is the cooperation group in the Phase- II upgrade plan is put forward for electronics module all FEB-2 will be used (such as the ADC, etc.) are integrated into a chip on chip front-end system "(Front-End System on Chip, FE-SOC) on the idea. At present the modules of FE-SOC pre research work is The various research units at the same time, the first prototype of ASIC forming circuit part of the 8 channel BNL developed before forming HLC1 chip, the requirements of the test and 8 channel France Omega/LAL group developed before ASIC LAUROC. chip for the two multi channel before forming ASIC, designed a general of the two a former put ASIC chip electronics and resistance test platform. The irradiation performance test platform test results show that it can meet the LAUROC chip and HLC1 chip electronics and radiation resistance testing needs. The innovation of this paper is shown in the following aspects: 1) is designed to run at the same time and configuration the measured pixel detector to be measured, the pixel readout chip (FE-I4B) control and readout, and at the same time for the whole beam test Telescope 6 IBL dual chip pixel detector module for data The pixel detector readout beam flow test platform. The high CMOS pixel detector for ATLAS detector Phase- II upgrade in use provides a means of testing. The use of this beam test system, ATLAS pixel detector cooperation team is the first to identify the detection efficiency of the important parameters such as the use of AMS 180nm high voltage CMOS process design AMS180Vx series small size pixel detector the prototype chip, directly promotes the full size verification chip using the technology of.2) pixel detector beam test platform using ATLAS to upgrade the general front-end data collection scheme using the "front-end link exchange system" (Front-End LInk, exchange, FELIX) as the data acquisition program, data bandwidth cap beam the test system from the previous level of Gigabit Ethernet or USB communication level directly to the 100Gbps (24Links * 4.8Gbps) grade.3) In view of the ATLAS detector Phase- II upgrade liquid argon calorimeter front-end readout electronics board anti irradiation needs, design a multi channel ADC radiation resistance test platform. Anti irradiation performance of ADS52J90 and ADI, two new commercial channel ADC: TI's AD9249 test using this platform.

【学位授予单位】：中国科学技术大学
【学位级别】：博士
【学位授予年份】：2017
【分类号】：O572.212

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1 刘洪斌;面向ATLAS Phase-Ⅱ升级部分探测器前端电子学测试平台的研究[D];中国科学技术大学;2017年

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