传感器TEC制冷封装技术研究

发布时间：2018-01-03 00:08

本文关键词：传感器TEC制冷封装技术研究　出处：《中国科学院大学(中国科学院光电技术研究所)》2017年硕士论文　论文类型：学位论文

【摘要】：某些传感器芯片,诸如图像传感器以及压力传感器等,其关键性能受温度影响很大,当温度大于绝对零度时,温度越高,其工作时产生的热噪声越大,灵敏度越低。为了解决这一工程问题,我们对部分传感器进行了热电制冷(TEC)封装的研究,利用热电制冷器对其进行制冷,以抑制因传感器工作时产生的热噪声或者高温导致的灵敏度降低等情况。研究表明高温也加速着传感器芯片的老化,因此给传感器芯片集成热电制冷封装是很有必要的。本文主要包括以下方面的内容:第一部分,介绍了传感器热电制冷封装的结构、功能、以及其研究意义。对传感器的制冷方法进行了总结和对比,并阐述了TEC制冷封装的优势与特点。并在此部分对热电制冷封装的国内外研究动态以及发展情况进行了介绍,指出此技术在国内外发展的水平及其不平衡。第二部分,介绍了热电制冷器的基本效应与基本原理,列出了热电制冷器的相关计算公式,帮助我们估算热电制冷器的制冷能力。对通用的热电制冷器选型的方法进行了总结,并介绍我们的热电制冷器选型的详细过程。第三部分,介绍了传感器TEC制冷封装的设计过程。首先对TEC制冷封装进行了基于ANSYS Icepak的有限元仿真分析,记录了详细的仿真步骤,并分析仿真结果。接下来研究了仿真得到的封装结构,总结了各部分的材料、密封腔的引线引出技术以及散热器的选择方法。最后对封装配套的TEC制冷控制系统的设计过程进行了阐述。本设计利用FPGA作为主控芯片,通过数字PID算法,输出PWM信号控制H桥以驱动热电制冷器。温度传感器使用了PT1000,通过MAX31865芯片转换电阻值传并送至FPGA。上位机通过串口与控制器进行通信,以设定制冷目标温度。第四部分,搭建了传感器TEC制冷封装实验平台,设计相关制冷实验并对实验结果进行了分析。
[Abstract]:Some sensor chips, such as image sensors and pressure sensors, whose key performance is greatly affected by temperature, when the temperature is greater than absolute zero, the higher the temperature, the greater the thermal noise generated when it works. In order to solve this engineering problem, we study the thermoelectric chiller packaging of some sensors and use thermoelectric refrigerators to refrigerate them. In order to restrain the thermal noise caused by the sensor working or the sensitivity decrease caused by the high temperature, the research shows that the high temperature also accelerates the aging of the sensor chip. So it is necessary to integrate thermoelectric refrigeration package into sensor chip. This paper mainly includes the following aspects: the first part introduces the structure and function of sensor thermoelectric refrigeration package. And its significance. The refrigeration methods of the sensor are summarized and compared. The advantages and characteristics of TEC refrigeration package are described. In this part, the domestic and foreign research trends and development of thermoelectric refrigeration package are introduced. The development level and unbalance of this technology at home and abroad are pointed out. In the second part, the basic effect and principle of thermoelectric cooler are introduced, and the calculation formulas of thermoelectric cooler are listed. To help us estimate the refrigeration capacity of thermoelectric refrigerators. The general method of thermoelectric refrigerators selection is summarized, and the detailed process of the selection of our thermoelectric refrigerators is introduced. The third part. The design process of sensor TEC refrigeration package is introduced. Firstly, the finite element simulation analysis of TEC refrigeration package based on ANSYS Icepak is carried out, and the detailed simulation steps are recorded. The simulation results are analyzed. Then, the encapsulation structure of the simulation is studied, and the materials of each part are summarized. The lead extraction technology of the seal chamber and the selection method of the radiator. Finally, the design process of the packaged TEC refrigeration control system is described. In this design, FPGA is used as the main control chip. Through the digital PID algorithm, the output PWM signal controls the H bridge to drive the thermoelectric cooler. The temperature sensor uses PT1000. The host computer communicates with the controller through serial port to set the refrigeration target temperature. 4th part. The experimental platform of sensor TEC refrigeration package was built, and the related refrigeration experiment was designed and the experimental results were analyzed.
【学位授予单位】：中国科学院大学(中国科学院光电技术研究所)
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TP212

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