不同处理方式对托槽再利用的粘结强度及摩擦力影响的研究

发布时间：2018-02-19 19:17

本文关键词： 托槽再利用处理方式剪切强度摩擦力扫描电镜　出处：《青岛大学》2014年硕士论文　论文类型：学位论文

【摘要】：目的探究不同处理方式对脱落托槽回收再利用后的粘结强度及摩擦力的影响。方法选择临床上因正畸而拔除的健康双尖牙70颗,其中30颗用于脱落托槽的制备。将脱落托槽依据不同的回收方法,随机均分为3组：半导体激光组、喷砂组、烧结组,同时以10颗新托槽作为对照组。在托槽再粘结前,以扫描电镜观察托槽底板表面形貌及托槽槽沟光洁度变化。后将四组托槽粘结在余下的40颗牙齿上,首先进行抗剪切强度的测试并统计牙面粘结剂残留指数,其次测定与0.019x0.025英寸的不锈钢方丝组合时的静动摩擦力。结果 1、新托槽组平均抗剪切强度最强(14.27Mpa±4.57),其次为喷砂组(13.36Mpa± 3.45),再次为激光组(11.38Mpa±2.81)及烧结组(10.65Mpa±4.24),四组间抗剪切强度无统计学差异(P0.05)。四组间粘结剂残留指数亦无统计学差异(P0.05)。 2、四组间静动摩擦力均无统计学差异(P0.05)。 3、托槽底板的扫描电镜观察：与网格清晰干净的新托槽相比,喷砂组托槽底板表面无粘结剂残留,但粗糙度明显增加；而激光组在网格间稍有杂质残存且托槽底板稍显粗糙；烧结组托槽底板网格间多有粘结剂残存。 4、.托槽槽沟的扫描电镜观察：新托槽槽沟可见不规则形状的突起,且在槽沟内分布均匀；喷砂组托槽槽沟可见多处团状堆积的小颗粒；烧结组槽沟内不规则突起较新托槽组明显；半导体激光组槽沟内不规则突起与新托槽比差异较小。结论三种不同的处理方式即半导体激光法、喷砂法、烧结法进行托槽回收再利用后,其粘结强度均可满足临床需要且经三种处理方式处理后的托槽再利用的摩擦力,与新托槽比,未发生显著性的改变。
[Abstract]:Purpose. The effects of different treatment methods on bond strength and friction force after recovery and reuse of shed brackets were investigated. Method. 70 healthy bicuspid teeth were extracted from orthodontics and 30 of them were used in the preparation of abscission brackets. According to different recovery methods, the abscission brackets were randomly divided into three groups: semiconductor laser group, sand blasting group, sintering group, and so on. At the same time, 10 new brackets were used as the control group. Before the bracket was rebonded, the surface morphology of the bracket bottom plate and the cleavage of the bracket groove were observed by scanning electron microscope. Then the four groups of brackets were bonded to the remaining 40 teeth. First, the shear strength was tested and the residual index of the binder was calculated. Secondly, the static and dynamic friction force was measured when combined with 0.019x0.025 inch stainless steel square wire. Results. 1. The average shear strength of the new bracket group was the strongest (14.27Mpa 卤4.57), followed by the sand blasting group (13.36Mpa 卤). 3.45m, 11.38Mpa 卤2.81in laser group and 10.65Mpa 卤4.24m in sintering group. There was no significant difference in shear strength among the four groups (P 0.05), and there was no significant difference in residual index of binder between the four groups (P 0.05). There was no statistical difference in static and dynamic friction force between the four groups (P 0.05). (3) SEM observation of bracket bottom plate: compared with the new bracket with clear and clean mesh, the sand blasting group had no residual binder on the bottom plate, but the roughness was obviously increased, while the laser group had some impurities remaining between the meshes and the bracket bottom was slightly rough. There are binder residues between the mesh of the bottom plate of the sintered bracket. (4) SEM observation of bracket groove: irregular protuberance was observed in the new bracket groove and distributed evenly in the trench, and there were many clusters of small particles in the grooves of sandblasting group. The irregular protrusions in the grooves in the sintered group were more obvious than those in the new bracket group, and the difference between the irregular protrusions in the grooves and the new brackets in the semiconductor laser group was smaller. Conclusion. Three different treatment methods, semiconductor laser method, sand blasting method and sintering method for recovery and reuse of brackets, the bond strength of the brackets can meet the clinical needs and the friction force of the brackets reused by the three treatment methods can be compared with that of the new brackets. No significant changes occurred.
【学位授予单位】：青岛大学
【学位级别】：硕士
【学位授予年份】：2014
【分类号】：R783.5

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