氩气低温等离子体处理对口腔修复用PEEK复合材料粘结性能的影响

发布时间：2018-05-16 19:10

  本文选题：等离子 + 聚醚醚酮　； 参考：《吉林大学学报(医学版)》2014年02期

【摘要】：目的:探讨氩气低温等离子体处理对聚醚醚酮(PEEK)及其复合材料剪切强度的影响,阐明PEEK及其复合材料的粘结机制。方法:将制备的纯PEEK作为对照组,PEEK复合材料作为实验组。将对照组和实验组的试件分别进行0、5、15和25min氩气低温等离子体表面处理(等离子0、5、15和25min组)。扫描电镜(SEM)观察试件经过处理后表面微观形貌变化。将处理后的试件与RelyXTM Unicem进行粘结,37℃水浴24h后检测试件的剪切强度,体视显微镜下评价其破坏模式。结果:经过氩气低温等离子体处理后,各组试件表面可见不同程度的凸状沉淀物和犁沟。对照组试件经过低温氩气等离子体处理5min后,剪切强度值比等离子0和15min组明显升高(P0.01);等离子25min组试件的剪切强度值与等离子5min组比较差异无统计学意义(P0.05)。实验组试件的剪切强度值,等离子5min组低于15和25min组(P0.05),等离子15 min与25min组的比较差异无统计学意义(P0.05)。实验组中等离子15min组试件的剪切强度值明显高于对照组(P0.05),其他各组之间比较差异无统计学意义(P0.05)。各组试件的破坏模式均主要以界面破坏为主。结论:氩气低温等离子体处理能有效地增强PEEK及其复合材料的剪切强度,随着处理时间的延长,剪切强度增大。试件表面硬度不同导致了纯PEEK及其复合材料剪切强度变化趋势的不一致。
[Abstract]:Aim: to investigate the effect of argon low temperature plasma treatment on the shear strength of polyether ether ketone peek (PEEK) and its composites, and to elucidate the bonding mechanism of PEEK and its composites. Methods: pure PEEK was used as control group and peek composite as experimental group. The samples of the control group and the experimental group were treated with low temperature plasma surface treatment (plasma 0 5 15) and 25min low temperature plasma (25min group), respectively. Scanning electron microscopy (SEM) was used to observe the surface morphology of the specimens after treatment. The shear strength of the treated specimen was measured after 24 hours of water bath at 37 鈩，

本文编号：1898069