串、并行设计对硬件产品设计缺陷的影响分析

发布时间：2018-02-12 20:33

本文关键词： 设计缺陷影响因素过程方法区间层次分析方法　出处：《机械设计》2016年01期 　论文类型：期刊论文

【摘要】：串、并行设计模式下硬件产品的设计缺陷形成机理存在差异,对串、并行设计模式与设计缺陷之间的关系进行系统地分析、比较,有助于在产品设计过程中预防、控制设计缺陷。采用过程方法,分别构建了从输入、输出、资源、环境和监测评价活动五个方面系统反映串、并行设计各阶段缺陷影响因素的结构要素模型,进而迭代获得描述串、并行设计过程各设计阶段、各类设计缺陷和可能存在的缺陷因素三者之间的结构关系模型。在此基础上,利用区间层次分析法定量地表达了串、并行设计的设计缺陷与其影响因素之间的关系。最后,从设计缺陷预防和控制的角度,对串、并行设计模式下设计缺陷结构关系进行比较与分析,研究成果对设计过程中预防和控制设计缺陷具有理论和实际指导意义。
[Abstract]:There are differences in the forming mechanism of hardware product design defects in serial and concurrent design mode. The relationship between string, parallel design pattern and design defect is systematically analyzed and compared, which is helpful for the prevention in the process of product design. Control design defects. By using the process method, the structural element model of the factors influencing the defects in each stage of concurrent design is constructed, which includes five aspects: input, output, resource, environment and monitoring and evaluation activities. Then the structural relationship models of description string, design stages of concurrent design process, various design defects and possible defect factors are obtained. On this basis, the string is expressed quantitatively by using interval Analytic hierarchy process (AHP). Finally, from the point of view of design defect prevention and control, this paper compares and analyzes the structural relationship of design defects in serial and concurrent design mode. The research results have theoretical and practical significance for the prevention and control of design defects in the design process.
【作者单位】：南昌大学机电工程学院;南昌航空大学经管学院;
【基金】：国家自然科学基金资助项目(71161018) 江西省教育厅资助项目(12717)
【分类号】：TB472

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