高抗氧化铜银双金属粉的制备及性能研究

发布时间：2018-04-02 15:10

  本文选题：铜银双金属粉　切入点：致密化处理　出处：《电镀与精饰》2016年04期

【摘要】：以铜粉为基体材料,在反应体系中加入铜离子掩蔽剂,采用化学置换法在铜粉表面多次包覆银及多次高温致密化处理,实现了银在铜粉表面的连续致密包覆。用X-射线衍射法、扫描电子显微镜、透射电子显微镜和热质量分析的方法对银包铜双金属粉进行了表征。结果表明,铜粉表面的银包覆层致密性好、包覆完全,在800℃以下的抗氧化性能良好。
[Abstract]:Copper powder was used as substrate, copper ion masking agent was added in the reaction system, silver was coated on the surface of copper powder by chemical replacement method and densified at high temperature. The continuous dense coating of silver on the surface of copper powder was realized.The silver coated copper bimetallic powder was characterized by X ray diffraction, scanning electron microscope, transmission electron microscope and thermal mass analysis.The results showed that the silver coating on copper powder had good compactness and complete coating, and the oxidation resistance below 800 鈩，

本文编号：1700933