柔性高阻隔薄膜材料的研究现状

发布时间：2018-07-05 15:19

本文选题：柔性高阻隔薄膜 + 热蒸发　；参考：《包装工程》2017年17期

【摘要】：目的为柔性高阻隔薄膜的应用提供理论指导。方法综述柔性高阻隔膜的应用现状及存在问题,总结热蒸发、化学气相沉积、原子层沉积等制备柔性高阻隔薄膜的方法、原理、特点及应用,展望高阻隔膜包装材料的发展前景。结果高阻隔薄膜制备工艺趋向于单次制备,采用等离子体辅助原子层沉积技术是制备超高阻隔薄膜的首选,原子层沉积(ALD)和分子层沉积(MLD)结合也是获得超高阻隔薄膜的未来发展方向。结论快速、高效地制备柔性高阻隔薄膜是包装工业的发展趋势。
[Abstract]:Objective to provide theoretical guidance for the application of flexible high barrier films. Methods the present situation and existing problems of flexible high barrier films were reviewed. The methods, principles, characteristics and applications of thermal evaporation, chemical vapor deposition and atomic layer deposition for the preparation of flexible high barrier films were summarized. Prospects for the development of high barrier membrane packaging materials. Results the preparation process of high barrier thin films tended to be single preparation. Plasma assisted atomic layer deposition was the first choice for the preparation of ultrahigh barrier films. The combination of atomic layer deposition (ALD) and molecular layer deposition (MLD) is also the future development of ultrahigh barrier films. Conclusion the rapid and efficient preparation of flexible high barrier film is the trend of packaging industry.
【作者单位】：北京印刷学院;山东工艺美术学院;
【基金】：国家自然科学基金(11375031,11505013) 北京市自然基金及重点基金(4162024,KZ201510015014,KZ0 4190116009/001,KM201510015009,KM201510015002)
【分类号】：TB484

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