缓冲包装跌落仿真误差分析

发布时间：2018-08-29 10:08

【摘要】：目的研究Ansys/LS-DYNA DTM模块跌落仿真分析与经典缓冲包装设计方法之间的误差,并分析阻尼及摩擦因数对仿真结果的影响。方法基于经典缓冲包装设计方法,分别设计线弹性与双线性材料为缓冲材料的产品-衬垫系统;利用Ansys/LS-DYNA DTM模块对线弹性与双线性缓冲材料的产品-衬垫系统进行跌落分析,对比分析理论设计与仿真分析结果。结果对于线弹性材料与双线性缓冲材料的产品-衬垫系统,Ansys/LS-DYNA DTM模块跌落仿真分析与经典缓冲包装理论设计之间的误差均在5%以内。系统阻尼的增加导致所受最大冲击加速度减小;摩擦因数对所受最大冲击加速度影响较小;线性粘滞系数的增加导致所受最大冲击加速度增加。结论对于一般的工程应用,Ansys/LS-DYNA DTM模块跌落仿真分析方法与经典缓冲包装设计方法之间的误差在允许范围内。
[Abstract]:Aim to study the error between the drop simulation analysis of Ansys/LS-DYNA DTM module and the classical buffer packaging design method, and to analyze the effects of damping and friction coefficient on the simulation results. Methods based on the classical cushioning packaging design method, the product liner system with linear elasticity and bilinear material as buffer material was designed, and the drop analysis of linear elastic and bilinear cushion system was carried out by using Ansys/LS-DYNA DTM module. The results of theoretical design and simulation analysis are compared. Results for linear elastic materials and bilinear cushioning materials, the error between the drop simulation analysis of Ansys / LS-DYNA DTM module and the theoretical design of classical cushioning packaging is less than 5%. With the increase of damping, the maximum impact acceleration decreases, the friction coefficient has little effect on the maximum impact acceleration, and the linear viscosity coefficient increases the maximum impact acceleration. Conclusion for general engineering applications, the error between Ansys / LS-DYNA DTM module drop simulation analysis method and classical buffer packaging design method is within the allowable range.
【作者单位】：湖南工业大学包装新材料与技术重点实验室;
【基金】：湖南省科技计划(2015JC3114) 湖南工业大学研究生创新基金(cx1501)
【分类号】：TB485.1

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