添加剂对从无氰电解质中电沉积铜的协同效应及其结构和形貌特征（英文）

发布时间：2018-04-10 22:10

本文选题：协同效应 + 葡萄糖酸盐　；参考：《Transactions of Nonferrous Metals Society of China》2017年07期

【摘要】：由于铜在低碳钢上的伽伐尼置换反应,酸性铜板在低碳钢基体上的电沉积比较困难。使用一种适宜的络合剂可解决这一问题,因为络合剂能通过形成配位化合物降低铜的电位。本文作者研究在碱性介质中以葡萄糖酸钠为络合剂从无氰电解质中电沉积铜。考察1,2,3-苯并三唑、十二烷基硫酸钠、聚乙二醇-800和糖精等添加剂对铜电沉积的影响。结果表明,这类添加剂不仅能降低电沉积铜的晶粒尺寸和晶界、改善其表面形貌,而且能提高电解质的均镀能力及电沉积铜的硬度。采用X射线衍射技术(XRD)对沉积铜进行表征。XRD结果表明,电沉积铜为多晶和面心立方结构。利用XRD结合原子力显微镜(AFM)计算电沉积铜的晶粒尺寸。在所研究的添加剂中苯并三唑和十二烷基酸钠混合添加剂的效果最好。用扫描电镜观察到的均匀无孔表面及AFM结果显示,上述添加剂能使电沉积铜的晶粒细化。
[Abstract]:Due to the Gavani substitution reaction of copper on low carbon steel, the electrodeposition of acid copper plate on low carbon steel substrate is difficult.This problem can be solved by using a suitable complexing agent, which can reduce the potential of copper by forming coordination compounds.The authors have studied the electrodeposition of copper from cyanide free electrolyte with sodium gluconate as complexing agent in alkaline medium.The effects of additives such as 1 (2)-(2)-triazole, sodium dodecyl sulfate, polyethylene glycol-800 and saccharin on the electrodeposition of copper were investigated.The results show that this kind of additive can not only reduce the grain size and grain boundary of electrodeposited copper, but also improve the surface morphology of electrodeposited copper, and the average plating ability of electrolytes and the hardness of electrodeposited copper.X-ray diffraction (XRD) technique was used to characterize the deposited copper. XRD results showed that the electrodeposited copper was polycrystalline and face-centered cubic structure.The grain size of electrodeposited copper was calculated by XRD and AFM.Among the additives studied, the mixture of benzotriazole and sodium dodecyl acid has the best effect.The results of SEM and AFM show that the additive can refine the grain size of electrodeposited copper.
【作者单位】： Electroplating
【分类号】：TQ153.14

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