固定化生物吸附剂处理含铜电镀废水的研究

发布时间：2018-07-10 00:30

  本文选题：固定化生物吸附剂 + 含铜电镀废水　； 参考：《电镀与环保》2017年06期

【摘要】：通过平板涂布法,从电镀污泥中筛选得到1株吸附Cu~(2+)性能优良的菌株,鉴定其为假单胞菌,并将其制成固定化生物吸附剂。研究了包埋比、吸附时间、温度、Cu~(2+)初始质量浓度、pH值、投加量对固定化生物吸附剂去除Cu~(2+)的影响。结果表明:当包埋比为1∶5、吸附时间为60min、温度为35℃、Cu~(2+)初始质量浓度为100mg/L、pH值为6、投加量为10g/L时,固定化生物吸附剂对Cu~(2+)的去除率可达到85.2%。
[Abstract]:A strain with excellent Cu ~ (2) adsorption was obtained from electroplating sludge by plate coating method. The strain was identified as Pseudomonas and was made into immobilized biological adsorbent. The effects of embedding ratio, adsorption time, initial mass concentration of Cu ~ (2), pH value and dosage on removal of Cu ~ (2) by immobilized biological adsorbent were studied. The results show that when the embedding ratio is 1: 5, the adsorption time is 60 min, the initial mass concentration of Cu2 is 100 mg 路L ~ (2) pH = 6 at 35 鈩，

本文编号：2111314