Ni-P-纳米TiN化学复合镀镀层性能研究

发布时间：2018-05-29 17:29

  本文选题：纳米复合镀 + 化学镀　； 参考：《齐齐哈尔大学》2017年硕士论文

【摘要】：纳米复合化学镀是在化学镀溶液中加入纳米粒子,使之与化学镀合金共沉积从而获得各种不同物理化学性质镀层的一种工艺。随着纳米材料学的发展,人们对纳米粒子性质的认识不断深化。纳米粒子具有很多独特的物理及化学性能,包括量子尺寸效应、表面效应、量子隧道效应等。纳米复合镀层与普通金属镀层相比,许多性能都得到了较大的提高,比如硬度、耐磨性、耐蚀性、抗高温以及光催化性等。本文采用比较的方法得出了纳米复合镀操作简单、价格低廉且得到的镀层也更为优良的工艺条件。纳米TiN作为纳米分散粒子,将其分散到Ni-P镀液中,在铜片基体上制得Ni-P-TiN复合镀层。在改良原有的工艺基础上,并探讨了不同条件下对纳米复合镀层的影响,从而方便、快速的制得纳米复合镀层,检测了镀层的形貌、沉积速度和硬度并讨论了纳米粒子分散性能。本文通过不同的表面活性剂、表面活性剂含量、不同配位剂、配位剂含量、不同润湿剂、润湿剂含量、纳米TiN含量、温度、施镀时间及pH等不同条件下对镀液分散性、稳定性的影响;并且对镀层形貌和硬度进行了测试和表征。借助SEM、XPS的分析,为镀层表面纳米粒子分散性能及镀层形貌提供了充分的依据。纳米化学复合镀镀铜的最佳工艺条件为:在机械搅拌下,温度为85℃、pH为5.5、时间为50 min、硫酸镍27 g/L、次亚磷酸钠26 g/L、无水乙酸钠13 g/L、乳酸4 g/L、丙三醇3 g/L、TiN3 g/L、聚乙烯亚胺2 g/L。
[Abstract]:Nano-composite electroless plating is a process in which nano-particles are added to electroless plating solution and codeposited with electroless plating alloy to obtain various kinds of electroless coatings. With the development of nanomaterials, people have a deeper understanding of the properties of nanoparticles. Nanoparticles have many unique physical and chemical properties, including quantum size effect, surface effect, quantum tunneling effect and so on. Compared with conventional metal coatings, nanocomposite coatings have been improved in many aspects, such as hardness, wear resistance, corrosion resistance, high temperature resistance and photocatalysis. In this paper, the process conditions of nanocomposite plating are obtained, which are simple operation, low price and better coating. Nano-sized TiN was dispersed into Ni-P solution as nano-dispersed particles, and Ni-P-TiN composite coating was prepared on copper substrate. On the basis of improving the original technology and discussing the influence of different conditions on the nano-composite coating, the nanocomposite coating was prepared conveniently and quickly, and the morphology of the coating was examined. Deposition rate and hardness were also discussed. In this paper, different surfactants, surfactant contents, different coordination agents, coordination agent contents, different wetting agents, wetting agent content, nanometer TiN content, temperature, plating time and pH were used to disperse the plating solution. The morphology and hardness of the coating were tested and characterized. With the help of the analysis of SEM XPS, it provides a sufficient basis for the dispersion of nanoparticles on the surface of the coating and the morphology of the coating. The optimum conditions of electroless copper plating are as follows: mechanical stirring, temperature 85 鈩，

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