糊状钎剂浓度对其黏附行为的影响
发布时间：2018-09-04 12:44
【摘要】：针对糊状钎剂在钎料表面难以均匀润湿铺展的问题,采用金相显微镜、润湿角测定仪、表面张力仪等分析设备,对不同浓度糊状钎剂在钎料表面的黏附行为进行研究。结果表明:糊状钎剂的黏附层随浓度的增大而逐渐增厚,薄黏附层发生少量收缩现象,厚黏附层发生大量下滑脱落及收缩现象。对于理想表面,不同浓度糊状钎剂的黏附张力相同。对于实际表面,表面条纹槽对糊状钎剂具有附加压力作用,附加压力是黏附层收缩发生滞后现象的主要原因。随着糊状钎剂浓度的增大,附加压力和滞后阻力减小,收缩加剧。薄黏附层收缩需满足:ΔWC≥A+ΔP,即收缩现象发生与否主要取决于黏附张力和附加压力。
[Abstract]:In order to solve the problem that the paste flux is difficult to spread uniformly on the surface of solder, the adhesion behavior of different concentration paste flux on the surface of solder is studied by means of metallographic microscope, wetting angle tester and surface tension meter. The results show that the adhesive layer of the paste flux increases gradually with the increase of the concentration, a small amount of shrinkage occurs in the thin adhesive layer, and a large number of slippage and shrinkage occur in the thick adhesive layer. For ideal surfaces, the adhesive tension of different concentrations of paste flux is the same. For the actual surface, the surface stripe groove has the additional pressure on the paste flux, and the additional pressure is the main reason for the hysteresis of the adhesion layer shrinkage. With the increase of the paste flux concentration, the additional pressure and hysteresis resistance decrease, and the shrinkage intensifies. The shrinkage of the thin adhesive layer should be satisfied: 螖 WC 鈮，
本文编号：2222138
[Abstract]:In order to solve the problem that the paste flux is difficult to spread uniformly on the surface of solder, the adhesion behavior of different concentration paste flux on the surface of solder is studied by means of metallographic microscope, wetting angle tester and surface tension meter. The results show that the adhesive layer of the paste flux increases gradually with the increase of the concentration, a small amount of shrinkage occurs in the thin adhesive layer, and a large number of slippage and shrinkage occur in the thick adhesive layer. For ideal surfaces, the adhesive tension of different concentrations of paste flux is the same. For the actual surface, the surface stripe groove has the additional pressure on the paste flux, and the additional pressure is the main reason for the hysteresis of the adhesion layer shrinkage. With the increase of the paste flux concentration, the additional pressure and hysteresis resistance decrease, and the shrinkage intensifies. The shrinkage of the thin adhesive layer should be satisfied: 螖 WC 鈮，
本文编号：2222138
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