双辊甩带制备Au-20%Sn焊料及其均匀化退火工艺

发布时间：2018-01-27 23:39

  本文关键词： 双辊法 金锡焊料 均匀化退火　出处：《中南大学学报(自然科学版)》2015年11期 　论文类型：期刊论文

【摘要】：采用双辊甩带技术制备Au-20%Sn焊料薄带材,观察和分析快速凝固Au-20%Sn焊料薄带的显微组织以及熔融特性,并研究合金的均匀化退火工艺。研究结果表明:双辊甩带合金由ζ′(An5Sn)和δ(Au Sn)两相组成,显微组织细小。合金的熔化温度接近共晶点,满足焊料的熔点要求。均匀化退火过程中,δ(Au Sn)相逐渐长大,合金的硬度降低。根据薄带的组织和硬度,确定均匀化退火工艺为260℃下退火4 h。
[Abstract]:The Au-20%Sn solder thin strip was prepared by double roll strip casting technique. The microstructure and melting characteristics of the rapid solidification Au-20%Sn solder strip were observed and analyzed. The homogenization annealing process of the alloy is also studied. The results show that the double roll zipper alloy consists of Zeta (An5SnN) and 未 -Au (Sn2) phases. The microstructure is fine. The melting temperature of the alloy is close to the eutectic point, which meets the melting point requirement of solder. According to the microstructure and hardness of the strip, the homogenization annealing process was determined to be annealed at 260 鈩，

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