熔石英元件抛光加工亚表面缺陷的检测

发布时间：2018-07-05 12:34

本文选题：熔石英元件 + 亚表面缺陷　；参考：《材料科学与工艺》2015年02期

【摘要】：亚表面缺陷的准确检测是进行亚表面损伤研究的前提和基础,对保证光学元件加工质量至关重要.基于HF酸化学蚀刻法对熔石英元件抛光加工产生的亚表面水解层、缺陷层深度和亚表面损伤形貌进行了定量检测,并利用X射线荧光光谱法研究了熔石英抛光试件杂质元素的种类和元素含量沿深度分布规律,提出了熔石英元件抛光加工亚表面损伤深度的判定方法.研究表明:由于水解层和亚表面缺陷层的存在,熔石英抛光试件的蚀刻速率随着时间的增加呈现递减的趋势,且在蚀刻的初始阶段蚀刻速率下降尤为明显;当蚀刻深度超过某一特定值后,全部或部分覆盖在水解层以下的缺陷层将会被完全蚀刻去除,蚀刻速率基本保持不变;另外,熔石英抛光试件存在多种形式的表面及亚表面缺陷,在不同蚀刻深度,亚表面损伤形貌、划痕的宽度和深度也存在一定的差异.
[Abstract]:The accurate detection of subsurface defects is the premise and foundation for the study of subsurface damage, and it is very important to ensure the quality of optical components. Based on HF acid chemical etching method, the subsurface hydrolyzed layer, the depth of defect layer and the morphology of subsurface damage produced by polishing of fused quartz element were quantitatively detected. The distribution of impurity elements and element content along the depth of fused quartz polishing specimen was studied by X-ray fluorescence spectroscopy. The method of judging the depth of subsurface damage in polishing of fused quartz element was put forward. The results show that the etching rate of fused quartz polishing samples decreases with time due to the existence of hydrolysis layer and subsurface defect layer, and the decrease of etching rate is especially obvious in the initial stage of etching. When the etching depth exceeds a certain value, the defect layer covered in whole or part below the hydrolysis layer will be completely etched and the etching rate will remain basically unchanged. There are many kinds of surface and subsurface defects in fused quartz polished specimens. There are also some differences in etching depth, subsurface damage morphology, width and depth of scratches.
【作者单位】：哈尔滨工业大学机电工程学院;中国工程物理研究院激光聚变研究中心;
【基金】：国家自然科学基金委员会与中国工程物理研究院联合基金资助项目(U1230110) 国家自然科学基金资助项目(51475106) 中国工程物理研究院超精密加工技术重点实验室开放基金项目(KF14007)
【分类号】：TG580.692

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