柔性自动化微装配的自主式显微视觉技术

发布时间：2018-08-20 08:28

【摘要】：针对非硅微机电系统自动化、柔性、高精度、高效的装配特点,提出并实现了一种基于金属氧化物半导体(CMOS)、现场可编程门阵列(FPGA)及数字信号处理器(DSP)的显微视觉系统设计方法.该方法兼顾了模块化、柔性与可重配置、高检测精度及速度等系统主要指标,实现了结构模块化、功能可重配置、具有非常高的检测精度及速度的显微视觉系统.通过实验分析了系统的物理分辨率以及对测量精度进行了标定,验证了系统的设计技术指标.结果表明:系统对非硅MEMS器件的最高测量精度可达0.6μm,检测时间小于0.65s,不仅满足了现有微小型零件柔性自动化装配的要求,同时也为微小型零件的高精度、高速度检测提供了重要的解决方法.
[Abstract]:Aiming at the automatic, flexible, high precision and high efficiency assembly characteristics of non-silicon MEMS, a design method of microscopic vision system based on metal oxide semiconductor (CMOS),) field programmable gate array (FPGA) and digital signal processor (DSP) is proposed and implemented. This method takes into account modularization, flexible and reconfigurable, high detection precision and speed, etc. It realizes the structure modularization, the function can be reconfigured, and has a very high detection precision and speed microscopic vision system. The physical resolution of the system and the calibration of the measurement accuracy are analyzed through experiments, and the design technical index of the system is verified. The results show that the maximum measuring accuracy of the system for non-silicon MEMS devices can reach 0.6 渭 m and the detection time is less than 0.65 s, which not only meets the requirements of flexible automatic assembly of micro parts, but also provides high precision for small parts. High speed detection provides an important solution.
【作者单位】：北京理工大学机械与车辆学院;
【基金】：国家自然科学基金资助项目(51127004) 国家部委预研项目(A0920110013)
【分类号】：TG95;TP391.41

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