7055铝合金多道次热变形及固溶处理中的组织演变
发布时间：2019-05-20 01:46
【摘要】：定量研究了7055铝合金进行多道次热变形及固溶处理中的微观组织演变,采用Gleeble-1500D热模拟试验机对7055铝合金进行多道次热压缩,并对热压缩试样进行固溶处理。以EBSD为主要分析手段,对平均晶粒尺寸、再结晶体积分数、大角度晶界比例等微观组织特征进行定量表征。结果表明:升高变形温度和减少变形道次均有利于增大亚结构比例并且抑制再结晶。当变形温度由375℃升高到425℃时,7055铝合金固溶态显微组织的晶粒平均尺寸由65μm增大到420μm,再结晶体积分数由51%减小到10%;当变形道次由单道次增加到3道次时,固溶态显微组织的晶粒平均尺寸由56μm增大到84μm,再结晶体积分数由14%增大到23%。
[Abstract]:The microstructure evolution of 7055 aluminum alloy during multi-pass thermal deformation and solid solution treatment was studied quantitatively. 7055 aluminum alloy was subjected to multi-pass thermal compression by Gleeble-1500D thermal simulation tester, and the hot compression sample was treated with solid solution. The microstructure characteristics of average grain size, recrystallized volume fraction and large angle grain boundary ratio were quantitatively characterized by EBSD. The results show that the increase of deformation temperature and the decrease of deformation pass are beneficial to increase the proportion of substructure and inhibit the crystallization. When the deformation temperature increases from 375 鈩，
本文编号：2481249
[Abstract]:The microstructure evolution of 7055 aluminum alloy during multi-pass thermal deformation and solid solution treatment was studied quantitatively. 7055 aluminum alloy was subjected to multi-pass thermal compression by Gleeble-1500D thermal simulation tester, and the hot compression sample was treated with solid solution. The microstructure characteristics of average grain size, recrystallized volume fraction and large angle grain boundary ratio were quantitatively characterized by EBSD. The results show that the increase of deformation temperature and the decrease of deformation pass are beneficial to increase the proportion of substructure and inhibit the crystallization. When the deformation temperature increases from 375 鈩，
本文编号：2481249
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