可剥离超薄载体铜箔的电沉积研究
发布时间：2019-06-04 12:08
【摘要】：铜箔是制造印制电路板(PCB)的关键性导电材料。随着PCB朝着多层化、薄型化、高密度化、高速化方向发展,对具有超薄、低轮廓、高强度、高延展性等高品质的铜箔的需求愈加紧迫。所以超薄铜箔的制备和剥离问题已经成为铜箔行业的研发热点。本文旨在寻求新的单一或复合的有机剥离层组分,能够在载体表面一次吸附成膜,用于制备最小厚度不超过4μm的超薄载体铜箔。本文用于形成剥离层的有机物有三种,包括苯并三氮唑(BTA)、噻唑类化合物MAT、以及MAT和植酸的混合物,其中BTA是作为参照物加以实验。采用恒电流法在35μm厚度的载体铜箔上沉积超薄铜箔,优化有机吸附液浓度及吸附时间、沉积电流密度、沉积温度和沉积时间；采用光学显微镜和扫描电子显微镜对所制备的超薄铜箔进行表面形貌表征；采用Taf'el法和交流阻抗法分析各种剥离层对铜沉积电子传递过程的影响。结果表明,在铜箔沉积过程中,剥离层本性及吸附量、电流密度、温度等因素对超薄铜箔的表面均匀性和可剥离性有明显的影响,且不同剥离层对铜沉积电子传递过程的影响差异甚大。BTA剥离层对铜沉积反应的阻力很大,且形成有效剥离层的BTA浓度高达10 g.L-1,制得的铜箔最小厚度为MAT剥离层对铜沉积反应的阻力远小于BTA,形成有效剥离层的MAT浓度不超过1.0 g.L-1,制得的铜箔为片层状结晶、表面平整的低轮廓铜箔,最小厚度不超过4μm。将植酸引入MAT中形成复合剥离层,使铜沉积反应的阻力大为增加,制得的铜箔最小厚度进一步减小为3μm,但铜箔的表面形貌对电流密度的大小很敏感,电流密度增大到6.0 A.dm-2以上时,铜箔表面颗粒变得粗糙疏松。总之,MAT作为一种新型剥离层明显优于BTA；植酸作为一种铜离子螯合剂在减小超薄铜箔厚度方面起到了初步的作用。
[Abstract]:Copper foil is the key conductive material for manufacturing printed circuit board (PCB). With the development of PCB towards multi-layer, thin, high density and high speed, the demand for ultra-thin, low profile, high strength, high extensibility and other high quality copper foil is becoming more and more urgent. Therefore, the preparation and peeling of ultra-thin copper foil has become a hot research and development topic in copper foil industry. The purpose of this paper is to find a new single or composite organic peeling layer component, which can be adsorbed on the surface of the carrier to form a film at one time, and can be used to prepare ultra-thin carrier copper foil with a minimum thickness of not more than 4 渭 m. In this paper, there are three kinds of organic compounds used to form stripping layer, including benzotriazole (BTA), thiazole compound MAT, and the mixture of MAT and phytic acid, in which BTA is used as a reference. Ultra-thin copper foil was deposited on 35 渭 m thick carrier copper foil by constant current method. The concentration and adsorption time of organic adsorption solution, deposition current density, deposition temperature and deposition time were optimized. The surface morphology of the ultra-thin copper foil was characterized by optical microscope and scanning electron microscope, and the effects of various stripping layers on the electron transfer process of copper deposition were analyzed by Taf'el and AC impedance methods. The results show that the nature of stripping layer, adsorption capacity, current density and temperature have obvious effects on the surface uniformity and strippability of ultra-thin copper foil in the process of copper foil deposition. The influence of different stripping layers on the electron transfer process of copper deposition is very different. The resistance of BTA stripping layer to copper deposition reaction is very great, and the BTA concentration of effective stripping layer is as high as 10 g 路L ~ (- 1). The minimum thickness of the prepared copper foil is that the resistance of the MAT stripping layer to the copper deposition reaction is much lower than that of the effective stripping layer formed by BTA,. The MAT concentration of the effective stripping layer is not more than 1.0 g 路L 鈮，
本文编号：2492711
[Abstract]:Copper foil is the key conductive material for manufacturing printed circuit board (PCB). With the development of PCB towards multi-layer, thin, high density and high speed, the demand for ultra-thin, low profile, high strength, high extensibility and other high quality copper foil is becoming more and more urgent. Therefore, the preparation and peeling of ultra-thin copper foil has become a hot research and development topic in copper foil industry. The purpose of this paper is to find a new single or composite organic peeling layer component, which can be adsorbed on the surface of the carrier to form a film at one time, and can be used to prepare ultra-thin carrier copper foil with a minimum thickness of not more than 4 渭 m. In this paper, there are three kinds of organic compounds used to form stripping layer, including benzotriazole (BTA), thiazole compound MAT, and the mixture of MAT and phytic acid, in which BTA is used as a reference. Ultra-thin copper foil was deposited on 35 渭 m thick carrier copper foil by constant current method. The concentration and adsorption time of organic adsorption solution, deposition current density, deposition temperature and deposition time were optimized. The surface morphology of the ultra-thin copper foil was characterized by optical microscope and scanning electron microscope, and the effects of various stripping layers on the electron transfer process of copper deposition were analyzed by Taf'el and AC impedance methods. The results show that the nature of stripping layer, adsorption capacity, current density and temperature have obvious effects on the surface uniformity and strippability of ultra-thin copper foil in the process of copper foil deposition. The influence of different stripping layers on the electron transfer process of copper deposition is very different. The resistance of BTA stripping layer to copper deposition reaction is very great, and the BTA concentration of effective stripping layer is as high as 10 g 路L ~ (- 1). The minimum thickness of the prepared copper foil is that the resistance of the MAT stripping layer to the copper deposition reaction is much lower than that of the effective stripping layer formed by BTA,. The MAT concentration of the effective stripping layer is not more than 1.0 g 路L 鈮，
本文编号：2492711
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