嵌入式微投影仪的热分析与散热设计

发布时间：2018-01-03 08:34

本文关键词：嵌入式微投影仪的热分析与散热设计　出处：《电子科技大学》2012年硕士论文　论文类型：学位论文

更多相关文章： 微投影仪 热仿真 FLOTHERM 散热设计

【摘要】：随着移动通信技术和微投影仪技术的迅猛发展，微投影仪有望成为继摄像头之后移动设备中新的标准配置，以满足用户信息分享和信息显示的要求，市场潜力巨大。但是，它严峻的能耗和散热问题将严重制约它在移动设备应用中的发展。本文针对微投影仪的散热问题，选用德州仪器公司提供的DLP嵌入式微投影仪做热分析和热设计。在稳态模型热分析的基础上，，增加适量散热设计和优化，以求能在设计阶段提高微投影仪工作的热学性能。本课题来自UESTC-NOKIA国际合作项目。主要工作为： 1、了解微投影仪的工作原理和内部结构，确定微投影仪的主要热源为LED封装和DMD组件。 2、详细研究了LED封装、DMD组件等热流路径，为简化模型引入热阻法和集总参数法两种等效建模方法。对绿光LED面光源的进行稳态热建模，将仿真得到的芯片结点温度与由热阻推导出的理论值比较，验证了热仿真的准确性。 3、简化嵌入式微投影仪结构，整体模型进行稳态热建模，通过参数设定和网格划分，得到稳态条件下的温度分布。设计实验方案，并用热电偶测量得到多个温度测试点的温度值。将测量值与仿真值作比较，求出误差，并分析误差产生的原因。 4、合理添加散热肋片并对设计进行初步优化，有效地降低了LED结点温度，也减少了外壳表面的温差。
[Abstract]:With the rapid development of mobile communication technology and micro-projector technology, micro-projector is expected to become a new standard configuration of mobile devices after the camera to meet the requirements of user information sharing and information display. The market potential is huge. However, its severe energy consumption and heat dissipation will seriously restrict the development of its application in mobile devices. Aiming at the heat dissipation of microprojector, the DLP embedded microprojector provided by Texas Instruments Company is selected for thermal analysis and thermal design. Based on the thermal analysis of steady-state model, the appropriate amount of heat dissipation design and optimization are added. In order to improve the thermal performance of the micro projector in the design stage. This topic comes from the UESTC-NOKIA international cooperation project. The main work is as follows: 1. Understand the working principle and internal structure of the micro projector, and determine that the main heat sources of the micro projector are LED package and DMD module. 2. The heat flux path of LED packaging module is studied in detail. Two equivalent modeling methods, thermal resistance method and lumped parameter method, are introduced to simplify the model. The steady-state thermal modeling of green LED surface light source is carried out. The veracity of thermal simulation is verified by comparing the temperature of chip node obtained by simulation with the theoretical value derived from thermal resistance. 3. The structure of embedded micro projector is simplified, the whole model is modeled by steady state heat, the temperature distribution under steady condition is obtained by parameter setting and mesh division, and the experimental scheme is designed. The temperature values of several temperature test points are measured by thermocouple, and the error is calculated by comparing the measured values with the simulation values, and the causes of the errors are analyzed. 4. By adding heat dissipating rib and optimizing the design, the temperature of LED node and the temperature difference of shell surface are reduced effectively.
【学位授予单位】：电子科技大学
【学位级别】：硕士
【学位授予年份】：2012
【分类号】：TN946.1;TP368.1

【参考文献】