USB3.0高速信号完整性分析及其应用

发布时间：2018-02-24 06:19

本文关键词： 通用串行总线信号完整性三维全波电磁仿真混合模S参数高速电路设计　出处：《西安电子科技大学》2012年硕士论文　论文类型：学位论文

【摘要】：现今的高速系统中,信号传输速率及时钟频率的不断提高,当高速信号经过互连线时会产生延迟、反射、衰减、串扰、色散等信号完整性问题。信号完整性问题已成为高速数字系统设计是否成功的关键问题之一。通用串行总线(USB)协会于2008年推出USB3.0规范,数据传输速度达到5Gbps,是USB2.0传输速度的10倍。因此信号完整性问题成为USB3.0电路设计的关键因素。本文首先介绍了USB的总线特点,比较了USB2.0与USB3.0的共同点及差异点,说明了USB3.0的体系结构及数据传输,给出了USB3.0的测试项目。然后,研究了信号完整性问题及其分析方法,推导了不同拓扑结构差分电路的混合模S参数表达式,并将其应用到高速差分互连系统的信号完整性分析。接下来主要围绕电磁建模仿真,运用三维全波电磁仿真软件HFSS,仿真分析了单端和差分传输线上测试点及过孔的添加对USB3.0高速信号传输的影响；然后从这些分析结果中得出结论,建立设计规则,从而指导高速电路的设计,解决信号完整性问题；最后,完成了主板的电路设计、布局与布线；板级USB3.0信号仿真分析；对实际主板的USB3.0信号进行了测试。本论文中提出的设计规则对改善高速信号完整性起到很好的效果,并且已经推广到第三代串行硬件驱动器接口(SATA3.0)设计中。
[Abstract]:In today's high speed system, the increasing of signal transmission rate and clock frequency will cause delay, reflection, attenuation and crosstalk when high speed signal passes through the interconnect. Dispersion and other signal integrity problems. Signal integrity has become one of the key problems in the design of high-speed digital systems. The Universal Serial bus (USB) Association introduced the USB3.0 specification in 2008. The speed of data transmission is 5 Gbpss, which is 10 times faster than that of USB2.0, so the problem of signal integrity becomes a key factor in the design of USB3.0 circuits. This paper first introduces the characteristics of USB bus, compares the common points and differences between USB2.0 and USB3.0, explains the architecture and data transmission of USB3.0, and gives the test items of USB3.0. Then, the problem of signal integrity and its analysis method are studied. The mixed mode S parameter expressions of different topology differential circuits are derived and applied to the signal integrity analysis of high speed differential interconnection systems. In this paper, the influence of test points and holes on USB3.0 high-speed signal transmission is analyzed by using 3D full wave electromagnetic simulation software HFSS, and the design rules are established by drawing conclusions from these analysis results. In order to guide the design of high-speed circuit, solve the problem of signal integrity; finally, the main board circuit design, layout and wiring; board level USB3.0 signal simulation analysis; the actual motherboard USB3.0 signal testing. The design rules proposed in this paper have a good effect on improving the high speed signal integrity and have been extended to the design of the third generation serial hardware driver interface SATA3.0).
【学位授予单位】：西安电子科技大学
【学位级别】：硕士
【学位授予年份】：2012
【分类号】：TP336;TN911.6

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