APU温度测试方案与系统实现

发布时间：2018-05-18 01:12

本文选题：APU + 温度测试　；参考：《西安电子科技大学》2013年硕士论文

【摘要】：随着半导体技术的飞速发展,器件的微型化和集成化成了主要的目前集成电路行业的趋势。在处理器行业,也提出了融合理念,并推出了新的产品APU。APU的问世对半导体测试带来了新的挑战。需要设计一个新的测试系统来完成对APU产品温度测试精度的要求。针对APU的产品特性,分析原有APU测试系统的测试机制,并研究其在新系统型芯片、系统测试中面临的问题及不足,在此基础上提出新APU温度测试系统架构,分析其性能及实现方法。针对系统中的热阻二极管对APU的测试产生的误差太大,在温度测试系统中采用多点采集模式,并加入了核心的TCC计算控制电路,从而实现了整个温度控制系统的完善,并且针对新的控制系统,搭配了完整的温度控制模块,定义了完整的温度信号的处理逻辑。新的温度测试系统完善之后对其进行验证校准,完成了整个温度控制系统的实现,并用于生产测试,提高了产品的测试成品率
[Abstract]:With the rapid development of semiconductor technology, the miniaturization and integration of devices have become the main trend of integrated circuit industry. In the processor industry, the concept of integration is also proposed, and the introduction of a new product, APU.APU, has brought new challenges to semiconductor testing. A new test system needs to be designed to meet the requirements of APU product temperature measurement accuracy. According to the product characteristics of APU, the testing mechanism of the original APU test system is analyzed, and the problems and shortcomings in the new system chip and system test are studied. On this basis, a new APU temperature testing system architecture is proposed. Its performance and implementation method are analyzed. In view of the error caused by the thermal resistance diode in the system to the APU test, the multi-point acquisition mode is adopted in the temperature test system, and the core TCC calculation control circuit is added to realize the perfection of the whole temperature control system. For the new control system, a complete temperature control module is used to define the logic of temperature signal processing. The new temperature test system is verified and calibrated after it is completed, and the whole temperature control system is realized, which is used for production test and improves the test yield of the product.
【学位授予单位】：西安电子科技大学
【学位级别】：硕士
【学位授予年份】：2013
【分类号】：TN307;TP332

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