嵌入式平台的热分析与热优化设计

发布时间：2018-06-12 22:44

本文选题：热失效 + 热干扰　；参考：《中北大学》2012年硕士论文

【摘要】：本论文是以某嵌入式系统为设计背景，这个系统像其他嵌入式系统一样，采用了集成电路、元器件、以及高速电子电路等，由于这个系统的工作环境的复杂，使得系统失效的原因很多，但是过热或热缺陷是失效的原因之一。因此，研究热设计对提高现代电子产品的可靠性和加快人类生活的低碳化发展具有极其重要的意义。首先，本文以传热理论为依据，对嵌入式系统中造成温升的原因进行分析，并对PCB板运用微元体热平衡法建立了PCB板的数学模型，通过对节点的温度分布来确定元器件在电路板设计中的布局。同时分析了PCB板中两种主要的辐射干扰：热辐射与热传导耦合，以及抑制热失效的措施。其次，对PCB板上的电子元器件组件的热分析进行了详细研究，从而以更准确、快速的热分析方法评价了嵌入式系统的热特性及对PCB板热性能的影响，为PCB板的热设计提供了可靠的基础。其中，在设计的硬件平台中，主要是以外围电路的设计为主，因为在外围电路设计中热辐射与热传导耦合是主要的热干扰源，所以，在PCB板元器件的布局设计过程中适当考虑减少有源器件电路在基板上的数量，可以对PCB板的的温度场分布进行优化。最后，在设计中采用Flotherm仿真软件对PCB板建模仿真，并利用Fluck红外测温仪对制作好的电路板进行了热效应测试，且对没有进行热设计的PCB板进行测试，通过Smart View3.0软件分析，给出温度场的所有数据，从而，，对电子产品的设计做一个比较可靠的实验结果和设计指导，为获得更好热性能的电子产品打下夯实的基础。
[Abstract]:This paper is based on an embedded system, which, like other embedded systems, uses integrated circuits, components, and high-speed electronic circuits, etc., because of the complexity of the working environment of this system. There are many causes of system failure, but overheating or thermal defects are one of the causes of failure. Therefore, it is of great significance to study thermal design to improve the reliability of modern electronic products and accelerate the development of low carbonization of human life. Firstly, based on the theory of heat transfer, this paper analyzes the cause of temperature rise in embedded system, and establishes the mathematical model of PCB board by means of micro-element heat balance method. The temperature distribution of the node is used to determine the layout of the components in the circuit board design. At the same time, two main kinds of radiation interference in PCB are analyzed: the coupling of thermal radiation and heat conduction, and the measures to restrain thermal failure. Secondly, the thermal analysis of electronic components on PCB board is studied in detail, and the thermal characteristics of embedded system and its influence on thermal performance of PCB board are evaluated by more accurate and fast thermal analysis method. It provides a reliable basis for the thermal design of PCB board. Among them, in the design of hardware platform, the main design is peripheral circuit, because the coupling of thermal radiation and heat conduction is the main source of thermal interference in the peripheral circuit design. The temperature field distribution of PCB can be optimized by reducing the number of active circuit on the substrate in the process of PCB component layout design. Finally, the PCB board is modeled and simulated by Flotherm simulation software, and the thermal effect is tested by Fluck infrared thermometer, and the PCB board without thermal design is tested, and analyzed by Smart View 3.0 software. All the data of the temperature field are given, so that a reliable experimental result and design guidance for the design of electronic products are made, which will lay a solid foundation for obtaining better thermal properties of electronic products.
【学位授予单位】：中北大学
【学位级别】：硕士
【学位授予年份】：2012
【分类号】：TN41;TP368.1

【相似文献】