基于线结构光的三维重构技术的研究与应用

发布时间：2018-02-25 16:20

本文关键词： 线结构光三维重构线结构光标定自动插件机器视觉检测　出处：《华南理工大学》2016年硕士论文　论文类型：学位论文

【摘要】：在主要的几种三维重构技术中,基于线结构光的三维重构技术具有一些其他三维重构技术所不具备的特点。其中最突出的一点是对于三维重构对象的表面颜色变化不敏感,这使得该技术在实际应用场合更具有适用性,且不需要在重构对象表面涂上一层增强剂等。由于基于线结构光三维重构的这一技术实际使用中的精度大大依赖于该系统的标定精度,一种性能优异的标定算法对三维重构技术来说是至关重要的。为此本文分析了关于线结构光三维重构系统的标定原理和几种常见的标定方法。在此技术上提出了两种对线结构光系统的标定方法的新技术,从原理、数值仿真和实验验证三方面进行了详细的阐述。该标定方法使得线结构光三维重构系统的标定精度得到进一步保证,而且标定过程也大为简化。高速高精度电子组装设备是众多电子制造装备中比较高端的设备之一。该装备主要用于自动组装表贴电子元器件(SMT,Surface Mount Technology),针对电子信息制造业关键生产线研究而开发出的电子信息制造装备。目前自动电子组装设备对于表贴式电子元器件的组装能实现高速高精度自动化组装生产,但是对于异形件这类电子元器件的自动化组装,仍然有一些实际问题需要解决。如对于异形件等这一类的电子元器件,它们或多或少都有一些引脚,而且这些引脚常常会因为受到了外力的作用,发生各式各样的形变。结合线结构光三维重构技术的特点,把这一计算机视觉技术与实际相结合。即线结构光三维重构技术应用在异形件等一系列元器件的引脚三维重构及其弯曲感知的场合中,可以有所作为。本文最后一章给出了基于线结构光三维重构技术在电子元器件引脚三维重构的应用实例,分析了该过程在实际中使用的可能性与感知电子元器件引脚的弯曲程度的能力。
[Abstract]:Among the main 3D reconstruction techniques, the 3D reconstruction technology based on linear structured light has some characteristics that other 3D reconstruction techniques do not possess, the most prominent of which is that it is insensitive to the change of surface color of 3D reconstructed objects. This makes the technology more applicable in practical applications. There is no need to coat a layer of reinforcements on the surface of reconstructed objects. Because the accuracy of this technology based on linear structured light 3D reconstruction is greatly dependent on the calibration accuracy of the system. A calibration algorithm with excellent performance is very important for 3D reconstruction technology. In this paper, the calibration principle and several common calibration methods of linear structured light 3D reconstruction system are analyzed. Two new techniques for calibration of linear structured light systems, The principle, numerical simulation and experimental verification are described in detail. The calibration accuracy of the linear structured light 3D reconstruction system is further guaranteed by this calibration method. The calibration process is also greatly simplified. High speed and high precision electronic assembly equipment is one of the most advanced electronic manufacturing equipment. The equipment is mainly used for automatic assembly table attached electronic component SMT surface Mount technology for electronic information. Electronic information manufacturing equipment developed from the research of key production lines in manufacturing industry. At present, automatic electronic assembly equipment can realize high speed and high precision automatic assembly production for table-mount electronic components. However, there are still some practical problems to be solved for the automatic assembly of electronic components such as special-shaped parts, for example, for these kinds of electronic components, such as special-shaped parts, they have more or less some pins. And these pins often have a variety of deformations due to external forces. Combined with the characteristics of 3D reconstruction of linear structured light, This computer vision technology is combined with practice, that is, linear structured light 3D reconstruction technology is applied in the case of pin 3D reconstruction and bending perception of a series of components, such as special-shaped parts, etc. In the last chapter of this paper, an application example of 3D reconstruction based on linear structured light in the pin of electronic components is given. The possibility of using this process in practice and the ability to perceive the bending degree of the pin of electronic components are analyzed.
【学位授予单位】：华南理工大学
【学位级别】：硕士
【学位授予年份】：2016
【分类号】：TP391.41

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