废弃电路板铜锡多金属粉隔膜电积回收锡实验研究

发布时间：2018-10-31 06:35

【摘要】：采用基于隔膜电积湿法冶金新工艺从废弃电路板铜锡多金属粉中高效提取金属锡,研究并优化了铜锡多金属粉浸出及隔膜电积提锡工艺.浸出实验结果表明,在温度为40℃,初始Sn~(4+)质量浓度50 g/L,HCl浓度4 mol/L,液固比为5∶1,循环浸出三次的条件下,锡浸出率约为96%,最终浸出液中Sn~(2+)质量浓度68.58 g/L.锡隔膜电积实验表明,在Sn~(2+)质量浓度40~100 g/L,HCl浓度3 mol/L,温度35℃,电流密度200 A/m2的条件下,阴极电流效率97.51%,能耗低于1 200 k Wh/t.在此优化条件下进行隔膜电积8 h,得到平整、致密且纯度99.9%的阴极锡板.
[Abstract]:High efficiency extraction of tin from waste circuit board copper-tin polymetallic powder was carried out by a new process of hydrometallurgy based on diaphragm electrowinning. The leaching process of copper-tin polymetallic powder and electrodeposition of tin by diaphragm were studied and optimized. The results of leaching experiments show that the leaching rate of tin is about 96 under the conditions of temperature 40 鈩，

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