皮秒激光多焦点隐形切割脆性材料研究

发布时间：2018-05-12 01:00

本文选题：石英 + 多焦点激光　；参考：《江苏大学》2017年硕士论文

【摘要】：随着光电行业和光通讯行业的快速发展,脆性材料因其良好的综合性能被广泛应用于LED灯丝和光纤PLC平面波导型光分路器等芯片中。科技的提高以及市场的需要促使这些芯片向小型化、高密度化、高速化方向发展。晶圆通过粘片、切割、研磨和抛光等工艺得到高性能、高成品率、高稳定性的芯片。有效提高单片晶圆内的产品的数量,窄划片道结构受到了很大的重视。在减少生产成本的同时,提高生产效率和产品质量是目前关注的重点。因此,蓝宝石、石英脆性材料的切割工艺和方法在实际生产应用中具有举足轻重的作用。本课题研制了一个激光多焦点隐形加工光学系统,旨在实现石英、蓝宝石等脆性透明材料高质量、高效率的加工,为蓝宝石灯丝以及PLC芯片等晶圆量产提供一个全新的的思路和技术方法。首先对激光隐形切割脆性材料时的传输特性进行了分析。主要考察了激光在各向异性的单轴晶体中传输的仿真结果;结合瞬态热传导理论、热弹性力学理论、断裂力学理论,分析了激光与脆性材料的断裂机制,最后结合相关理论分析激光多焦点隐形切割的断裂机理,为后文进行激光多焦点隐形切割分离脆性材料奠定理论基础。其次详细论述了激光隐形加工系统,分析了光路系统、运动系统、冷却系统的原理,描述激光隐形切割的加工过程;然后对激光多焦点加工系统光学原理进行了详细的解释,同时简单论述了多焦点系统在ZEMAX中的定量的设计过程。最后进行了皮秒多焦点隐形切割脆性材料的试验研究。通过激光隐形切割玻璃实验与传统热裂法进行对比和分析;开展激光单焦点和多焦点隐形切割石英、蓝宝石实验对比和分析;通过控制变量法进行试验,分析激光参数对切割质量的影响,并通过实验分析解释了一些试验现象;采用激光多焦点隐形切割PLC芯片,并对实验结果进行研究,分析了多焦点隐形切割的效果。
[Abstract]:With the rapid development of optoelectronic and optical communication industries, brittle materials have been widely used in LED filaments and optical fiber PLC planar waveguide splitters due to their good comprehensive properties. The improvement of technology and the need of market promote the development of these chips in the direction of miniaturization, high density and high speed. Wafer chips with high performance, high yield and high stability are obtained by wafer, cutting, grinding and polishing. In order to increase the number of products in single wafer, narrow-cut channel structure has been paid more attention. At the same time, improving production efficiency and product quality is the focus of attention. Therefore, cutting processes and methods of sapphire and quartz brittle materials play an important role in practical production and application. In this paper, a laser multi-focus invisible processing optical system is developed, which aims to achieve high quality and high efficiency processing of brittle transparent materials such as quartz and sapphire. It provides a new way of thinking and technology for bulk production of sapphire filament and PLC chip. Firstly, the transmission characteristics of the brittle material are analyzed when the laser is invisible to cut the brittle material. The simulation results of laser propagation in anisotropic uniaxial crystals are investigated, and the fracture mechanism between laser and brittle materials is analyzed by combining transient heat conduction theory, thermoelastic theory and fracture mechanics theory. Finally, the fracture mechanism of laser multi-focus stealth cutting is analyzed based on the related theory, which lays a theoretical foundation for separating brittle materials by laser multi-focus stealth cutting. Secondly, the laser stealth processing system is discussed in detail, and the principle of optical path system, motion system and cooling system is analyzed, and the process of laser stealth cutting is described, then the optical principle of laser multi-focus machining system is explained in detail. At the same time, the quantitative design process of multi-focus system in ZEMAX is briefly discussed. Finally, the experimental study on the brittle material with picosecond multi-focus stealth cutting is carried out. The experiments of laser invisible cutting glass are compared and analyzed with the traditional hot split method; the experiments of single focus and multi focus cut quartz and sapphire are carried out; the experiments are carried out by controlling variables. The influence of laser parameters on cutting quality is analyzed and some experimental phenomena are explained through experimental analysis. The effect of multi-focus stealth cutting is analyzed by using laser multi-focus stealth cutting PLC chip and the experimental results are studied.
【学位授予单位】：江苏大学
【学位级别】：硕士
【学位授予年份】：2017
【分类号】：TB32;TN249

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