改性羟基磷灰石晶须牙科复合树脂材料的制备及研究

发布时间：2018-05-08 18:38

  本文选题：树脂基复合材料 + 羟基磷灰石晶须　； 参考：《人工晶体学报》2017年03期

【摘要】：采用硅胶对制备的HAP晶须进行表面改性形成SiO_2颗粒附着,然后以硅胶改性的HAP晶须为填料混合甲基丙烯酸酯制备复合树脂材料。二氧化硅对晶须改性是通过形成凝胶颗粒与晶须结合并通过热处理形成牢固的结合。通过XRD、FT-IR光谱和SEM以表征微结构、键性质以及表面相组成。结果表明:经硅胶改性的HAP晶须表面有SiO_2小颗粒附着,随着煅烧温度的增加,SiO_2颗粒的数量明显增多,尺寸有变大的趋势。复合树脂材料的弯曲强度随改性晶须煅烧温度的增加而增加,以600℃煅烧的改性晶须为原料制备的树脂样品,其弯曲强度最高,达到89.46 MPa。
[Abstract]:HAP whiskers were modified by silica gel to form SiO_2 particles, and then HAP whiskers modified by silica gel were used as fillers to prepare composite resin materials. Silica modifies the whisker by forming the gel particles and the whisker and heat treatment to form a strong bond. The microstructure, bond properties and surface phase composition were characterized by XRD- FT-IR and SEM. The results show that there are small SiO_2 particles on the surface of HAP whiskers modified by silica gel, and the number of SiO2 particles increases obviously with the increase of calcination temperature, and the size tends to become larger. The flexural strength of the composite resin increases with the increase of the calcination temperature of the modified whisker. The flexural strength of the resin sample prepared by calcining the modified whisker at 600 鈩，

本文编号：1862558