含膨胀单体的新型牙科光固化复合树脂的耐磨性研究

发布时间：2018-05-20 09:42

  本文选题：新型光固化复合树脂 + 耐磨性能　； 参考：《青岛大学》2017年硕士论文

【摘要】：目的:探究含不饱和螺环原碳酸酯膨胀单体的新型牙科复合树脂的耐磨性,结合摩擦磨损试验后对试样的微观形貌分析进行摩擦磨损机理研究,从而为研发低收缩、耐磨性良好的树脂材料提供实验依据。方法:以双酚A双甲基丙烯酸缩水甘油酯(Bis-GMA)为树脂基质单体,双甲基丙烯酸二缩三乙二醇酯(TEGDMA)为稀释单体,并以70/30(wt/wt)的比例配制成基体树脂,以硅烷化处理后的Si O2微粉为无机填料,樟脑醌(CQ)/N,N-二甲胺基甲基丙烯酸乙酯(DMAEMA)(1wt%/2wt%)为光敏引发体系,以不加或加入3,9-二亚甲基-1,5,7,11-四氧螺[5,5]十一烷(BMSOC)分为组A和组B。引入新型高效的阳离子聚合光敏引发剂二苯基碘摀六氟磷酸盐(DPIHFP),以CQ/DMAEMA/DPIHFP(1wt%/2wt%/2wt%)组成三元光敏引发体系,以不加或加入BMSOC分为组C和组D。两种成品树脂Filtek TMZ350和Clearfil AP-X为对照组。将以上材料(n=5)混匀后充填于直径约10mm、高约6mm光固化树脂圆柱体模具中。光固化之后放于37℃水浴24小时。用DCW-1磨耗机模拟体外三体磨耗实验。树脂试样分别在经200次,400次,600,800次循环磨耗后,称重测量体积损失量、数显千分表测量树脂试样表面的固定13个点的高度,取平均值作为高度损失量,磨耗最后用粗糙度仪测定试样磨耗表面的粗糙度值。并在扫描电镜下观察磨耗后试样表面形态。用单因素方差分析(ANOVA)和Tukey's test的方法对组间平均值进行显著性差异分析并进行两两比较(P0.05)。用Pearson相关分析方法对高度磨耗量和体积损失量及两者与粗糙度之间进行相关性评价(P0.01)。结果:随磨耗次数的不断增加,各组树脂的磨耗量也随之增加。Filtek TMZ350的体积损失量最少,为(14.5571±1.5059)mm3;组B磨耗最多,为(79.7713±3.0986)mm3;其中二元光引发体系下的组A和组B间、三元光引发体系下的组C和组D之间的体积磨损量和高度磨损量没有统计学差异(P0.05)。磨耗后树脂表面粗糙度值范围是0.51μm~0.93μm。体积损失量与粗糙度之间没有相关性(r=-0.083)。扫描电镜下Filtek TMZ350和Clearfil AP-X的磨耗表面较光滑,其它组的树脂磨耗后表面较粗糙,其中三元光引发体系下的树脂磨耗表面较二元光引发体系致密。结论:1.在本实验膨胀单体的添加比例是Bis-GMA/(epoxy+SOC)为40/60的条件下,膨胀单体的加入并不能影响树脂材料的耐磨性。2.以阳离子引发剂二苯基碘摀六氟磷酸盐、CQ和DMAEMA组成的三元光引发体作为引发剂,可使实验中混杂树脂体系的耐磨性得到明显的提高。
[Abstract]:Objective: to study the wear resistance of a new dental composite resin containing unsaturated spirocyclic carbonate expansion monomer, and to study the friction and wear mechanism of the sample after friction and wear test, so as to develop low shrinkage. Good wear resistance of resin materials to provide experimental basis. Methods: bisphenol A bis-glycidyl dimethacrylate (Bis-GMA) was used as resin matrix monomer, triethylene glycol dimethacrylate (TEGDMA) was used as diluent monomer, and the matrix resin was prepared at the ratio of 70 / 30 t / WTT / wt. The silanized Sio _ 2 micropowder was used as inorganic filler, and camphor quinone (CQ) / N (N-dimethylaminoethyl methylaminoethyl methacrylate) (DMAEMAA) was used as the initiation system of Guang Min. The system was divided into two groups: group A and group B without or without addition of 3 ~ (9) -dimethylene-1-trimethylidene-5711-tetraoxomethoxonium (BMSOC). A novel cationic polymeric Guang Min initiator, diphenyl iodide hexafluorophosphate (DPIHFPN), was introduced to form a ternary Guang Min initiation system using CQ / DMAEMA / DPIHFPA / DPIHFPN 1 wt / 2 wtand / 2 wtcm. The initiators were divided into group C and group D without adding or adding BMSOC. Two kinds of finished resin Filtek TMZ350 and Clearfil AP-X were used as control group. The above materials are mixed and filled in the 6mm resin cylinder mould with a diameter of about 10 mm and a high diameter of about 10 mm. After light curing, put in water bath at 37 鈩，

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