某集成电路企业刻蚀工位有害物质逸散数值模拟研究
[Abstract]:In recent years, with the rise of electronic information industry and the deepening of the Internet era, the demand for electronic devices such as mobile phones, tablets and Internet communication equipment is increasing day by day, and the application of integrated circuits is becoming more and more extensive. The production process of integrated circuit industry is complex, the working procedure is many, the number of harmful factors is many, the contact is wide, the toxicity is big, the whole production process involves various kinds of harm of gas state, liquid state, dust, non-ionizing radiation and ionizing radiation. Therefore, the harmful factors of IC manufacturing enterprises should not be underestimated, it is very meaningful to study the occupational hazards. In this paper, the etching station of a practical IC manufacturing enterprise is selected as an example, the diffusion law of harmful HF gas is taken as the research object, and the influence factors of HF gas diffusion are analyzed by numerical simulation method. Firstly, the clean space of the etching station is simplified, and the abstract geometric model is established by using Gambit software and the mesh is divided. Then the geometric model was introduced into the hydrodynamic calculation software Fluent, to simulate the diffusion of HF gas which etched in different working conditions by setting different parameters. Finally the occupational hazards were analyzed according to the different diffusion conditions. The results show that under normal working conditions, the etching station HF gas in the integrated circuit manufacturing enterprise is volatilized and diffused in a certain time, and the range is about 50% of the calculation space. In addition, the quantity of air outlet, the location of outlet and the area of outlet are the key factors to influence the diffusion of HF gas in clean room. Firstly, compared with two air outlets, the movement path of HF gas in clean space of one outlet is more complex, and the diffusion range is larger, accounting for about 75% of the computational space. Second, when the exhaust outlet in the reaction chamber is cancelled (which can be regarded as the internal exhaust outlet fault), the diffusion of), HF gas is the worst in several simulations, and the movement path is very complex. The diffusion range occupies almost the entire computational space (100%); Third, compared with the exhaust port in the rear wall, the HF gas movement path is simple and the diffusion range is smaller, accounting for about 25% of the calculation space after the exhaust air outlet is set to the top surface. Fourth, the diffusion of HF gas is the best in several simulations when the area of the outlet is increased by twice. The movement path is very regular, the diffusion range is less than 10 times of the calculated space, which is 1/5 of the normal working condition diffusion range. It is suggested that the ventilation effect can be better ensured by setting the exhaust air outlet on the top surface of the reaction chamber of the oxide film corrosion machine and increasing the area accordingly. In addition, this article also puts forward the related occupational health suggestions for the actual work situation in this example.
【学位授予单位】:首都经济贸易大学
【学位级别】:硕士
【学位授予年份】:2017
【分类号】:R134
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