HDI板制作的共性关键技术研究与应用

发布时间：2018-06-26 07:40

本文选题：HDI印制电路板 + CO_2激光钻孔　；参考：《重庆大学》2014年硕士论文

【摘要】：印制电路板（Printed Circuit Board简称PCB）是各种电子产品的基础，其主要功能是支撑电子元器件，并实现元器件之间的电信号连通。随着电子技术的不断进步，电子产品不断向轻、薄、短、小的方向发展，高密度互连（High DensityInterconnection,HDI）技术便应运而生。随着HDI印制电路板朝着高密度化的方向发展，对HDI制备技术要求越来越高。本文主要对HDI板制作过程中的共性关键技术进行研究，并将研究成果应用于10层二阶阴阳HDI板工业试生产中。论文研究的主要结果如下： 1.HDI板微盲孔成孔工艺。以微盲孔的孔型为优化目标，应用单纯形优化技术，对CO2激光成孔工艺参数实施优化，获得的100μm的微盲孔优化工艺参数为：脉宽13.8μs，脉冲能量14.8mJ，脉冲次数2，光圈（Mask）2.2mm。工艺参数对真圆度影响关系为：脉冲能量脉冲宽度脉冲次数Mask；对上下孔径比的影响关系为：Mask脉冲能量脉冲宽度脉冲次数。在优化工艺参数条件下，100μm微盲孔的真圆度为99.32%、上下孔径比为82.36%，该孔型能够充分满足后续生产的要求； 2.微盲孔填镀工艺。以不溶性材料—钛篮，，作为阳极，系统研究了填孔电流密度与微盲孔填镀效果的关系。实验结果表明：小电流密度下，微盲孔填充率较高，但是填镀时间较长，生产效率较低；大电流密度下，虽然电镀时间缩短，但是微盲孔内出现空洞，严重影响电信号传输及其稳定性。在进一步研究电流密度与微盲孔填镀爆发期关系的基础上，提出了采用组合电镀工艺参数的设想。在组合电镀工艺参数为：1.8A/dm2×15min+1.0A/dm2×30min+1.8A/dm2×15min的条件下，微盲孔填充率高（96.1%）、电镀时间短，极大地提高了生产效率。 3.阶梯线路制作工艺。提出了一种流程简单、无磨板、制作成本低廉的阶梯线路板制作工艺，并通过优选抗蚀剂类型，建立15μm/30μm与15μm/45μm两种阶梯板的蚀刻补偿关系，成功实现了HDI阶梯线路板制作，形成了具有原创知识产权的HDI阶梯线路板制作技术。 4.共性关键技术用于试生产。利用博敏电子股份有限公司的工业生产线，将本文研究成果应用于试制“10层二阶阴阳HDI电路板”，获得了合格率为77.9%的10层二阶阴阳HDI电路板，为这些共性关键技术的工业应用奠定了基础。
[Abstract]:Printed Circuit Board (PCB) is the basis of all kinds of electronic products. Its main function is to support electronic components and to realize electrical signal connectivity between components. With the development of electronic technology and the development of electronic products in the direction of light, thin, short and small, the high density interconnection (HDI) technology emerges as the times require. With the development of high density HDI PCB, HDI fabrication technology is becoming more and more important. In this paper, the common key technologies in the process of making HDI boards are studied, and the results are applied to the industrial trial production of 10 layers of second-order Yin and Yang HDI boards. The main results are as follows: 1. HDI plate microblind hole forming process. Aiming at the hole shape of microblind hole, the optimization parameters of CO _ 2 laser were optimized by simplex optimization technique. The optimized parameters of 100 渭 m microblind hole were obtained as follows: pulse width 13.8 渭 s, pulse energy 14.8mJ, pulse number 2, aperture (Mask) 2.2mm. The effect of processing parameters on true roundness is as follows: the pulse number of pulse energy pulse width Maskand the relation of influence on the ratio of upper and lower aperture is the number of times of pulse width of energy pulse with the ratio of up and down Mask pulse. Under the optimized technological parameters, the true roundness of 100 渭 m microblind hole is 99.32, the ratio of upper and lower aperture is 82.36, the pass can fully meet the requirements of subsequent production; 2. Microblind hole filling plating process. The relationship between the filling current density and the effect of microblind hole plating was systematically studied with the insoluble material titanium basket as the anode. The experimental results show that the filling rate of microblind holes is higher at low current density, but the filling time is longer and the production efficiency is low. At high current density, although the electroplating time is shortened, there are holes in the microblind holes. The transmission and stability of electrical signals are seriously affected. Based on the further study of the relationship between the current density and the explosive period of microblind hole filling plating, the assumption of adopting the combined electroplating process parameters is put forward. Under the condition that the combined electroplating process parameter is: 1: 1.8 A / r / dm 2 脳 15min 1.0A/dm2 脳 30min 1.8A/dm2 脳 15min, the microblind hole filling rate is high (96.1%), the electroplating time is short, and the production efficiency is greatly improved. Ladder circuit manufacturing process. In this paper, a simple process, no grinding board and low cost step circuit board fabrication technology is proposed. By selecting the type of corrosion inhibitor, the etching compensation relationship between 15 渭 m / 30 渭 m and 15 渭 m / 45 渭 m step boards is established, and the HDI ladder circuit board fabrication is successfully realized. Has formed the original intellectual property right HDI ladder circuit board manufacture technology. 4. Common key technologies are used in trial production. Using the industrial production line of Bomin Electronics Co., Ltd., the research results of this paper are applied to the trial production of "10 layers of second order Yin and Yang HDI Circuit Board". The 10 layers of second order yin and yang HDI circuit board with a qualified rate of 77.9% are obtained. It lays a foundation for the industrial application of these common key technologies.
【学位授予单位】：重庆大学
【学位级别】：硕士
【学位授予年份】：2014
【分类号】：TN41

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