微米行程微膨胀型热开关热特性的仿真与试验

发布时间：2018-03-07 04:00

  本文选题：微膨胀型热开关　切入点：热特性　出处：《光学精密工程》2016年10期 　论文类型：期刊论文

【摘要】：为了提高空间热控分系统的散热调节能力和热环境适应性,设计了一种微米行程的微膨胀型热开关。介绍了热开关的结构组成和工作原理,通过理论-仿真-试验相结合的方式,计算评估了热开关的断开热阻、闭合热阻和开关比等关键热特性。依据热阻网络串并联关系计算热开关的理论特性,断开热阻为301.71K/W,闭合热阻为1.06K/W,开关比约为283.6。基于有限元模型分析热开关断开/闭合过程的瞬态热特性,热端发热功率为18 W时,热开关闭合响应时间为340s,触发温度为35.5℃,闭合热阻约为2.3K/W。在2次热开关性能测试试验中,闭合热阻和开关比分别为1.08K/W、279.4和1.67K/W、180.7,试验数据与理论计算高度一致。同时指出:装配调试过程的不确定性会造成微膨胀型热开关宏观热特性的小区域波动。本文工作可为后续微膨胀型热开关的结构优化设计、机械加工细化和装调方式改进提供参考。
[Abstract]:In order to improve the heat dissipation ability and thermal environment adaptability of the space thermal control subsystem, a micro-expansion thermal switch with micron stroke is designed. The structure and working principle of the thermal switch are introduced. Through the combination of theory, simulation and experiment, the key thermal characteristics of the thermal switch, such as open thermal resistance, closed thermal resistance and switch ratio, are calculated and evaluated. The theoretical characteristics of the thermal switch are calculated according to the series-parallel relationship of the thermal resistance network. The thermal resistance is 301.71 K / W, the closing thermal resistance is 1.06K / W, and the switching ratio is about 283.6. The transient thermal characteristics of the hot switching / closing process are analyzed based on the finite element model. When the heating power at the hot end is 18 W, the closing response time is 340 s and the trigger temperature is 35.5 鈩，

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