Fabrication of Metallic Structure Using Micro-stereolithogra

发布时间：2024-03-26 23:19

　　3D打印工艺(以前称为快速成型(RP))是一种附加制造工艺,而不是传统方法的减材制造。与传统制造不同的是,传统制造从一块材料开始,机械地去除不需要的材料,直到形成所需的零件,3D打印需要一个自下而上的过程,从零开始创建3D有形零件,逐层构建。该技术可广泛应用于工程领域,包括储能装置材料、低密度高强度复合材料等,但某些技术的材料选择有限,限制了其应用。因此,有必要对三维打印进行更多的研究,以确定如何提高储能装置的性能。一般而言,3D打印过程从使用计算机辅助设计(CAD)或扫描真实物理对象的计算机中的数字模型开始。将数字模型切片,生成许多有限厚度的横截面层,然后发送到3D打印机,该打印机将这些层依次组合,直到形成物理部件。在这一领域的大量研究已经产生了大量的添加剂制造技术,包括但不限于:熔融沉积建模(FDM)、选择性激光烧结(SLS)、立体光刻(SLA)。例如,利用由切片软件获得的模型横截面图,利用紫外激光逐层选择性地固化光敏聚合物树脂来制作物体。本论文旨在探讨微立体光刻技术之制程,以期找到一种方法来设计与制造一个具有微尺度孔隙的复杂金属结构。由于依赖光聚合工艺固化聚合物树脂的微立体光刻无...

【文章页数】：66 页

【学位级别】：硕士

【文章目录】：
Abstract
摘要
Table of Major Symbols and Units
Abbreviations
Chapter I Background Information
    1.1 Introduction to3D Printing
        1.1.1 Selective Binding
        1.1.2 Selective deposition
        1.1.3 Selective solidification
    1.2 Micro-stereolithography
    1.3 Metallization process
    1.4 Supercapacitors
    1.5 Objective of the project
    1.6 Thesis structure
Chapter II Micro-stereolithography3D Printing Technique
    2.1 Introduction
    2.2 Types of Micro-stereolithography
        2.2.1 ScanningμSL
        2.2.2 Two-photon polymerization
        2.2.3 Projection Micro-stereolithography(PμSL)
        2.2.4 Projection Micro-stereolithography(PμSL)systems
    2.3 Basic fabrication Processes
    2.4 Basic set-up of PμSL system
    2.5 Photopolymerization Process
Chapter III Methodology
    3.1 Introduction
        3.1.1 CAD Model
        3.1.2 Slicing of stl file
        3.1.3 Parameter setting
        3.1.4 Actual printing process
        3.1.5 Part removal
        3.1.6 Post-processing
    3.2 Results and discussion
    3.3 Mechanical test
        3.3.1 Introduction
        3.3.2 Theory
        3.3.3 Tensile test procedure
    3.4 Results
        3.4.1 Engineering stress and engineering strain
    3.5 Conclusion
Chapter IV Metallization process
    4.1 Introduction
        4.1.1 Vacuum metallization
        4.1.2 Thermal spray processes
        4.1.3 Electroless plating metallization
        4.1.4 Electroplating metallization
    4.2 Electroless Nickel Plating
        4.2.1 Introduction
        4.2.2 Electroless plating procedure
        4.2.3 Pre-treatment
        4.2.4 Actual electroless nickel plating
        4.2.5 Explanation
    4.3 Factors affecting electroless nickel plating process
        4.3.1 Stabilizers
        4.3.2 Energy
        4.3.3 pH
    4.4 Results and discussion
    4.5 Conclusion
Chapter V Conclusion and Future Work
    6.1 Conclusion
    6.2 Future work
References
Appendix A Mathematical model
Acknowledgement



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