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基于SCOR的半导体产业制造外包质量管理研究

发布时间:2018-07-20 15:02
【摘要】:半导体产业是现代信息产品生产制造的重要基础,在各行业均有着广泛的应用。在早期,半导体产业的运营模式是由生产企业承担产品设计、生产制造及市场销售各项业务,可以在企业内部对产品质量进行有效地控制。随着半导体产业的进一步发展与产业规模的不断扩大,受到成本竞争压力和资源整合优化、产业细分趋势的影响,其产业结构从原来的垂直整合型转变为水平分散型,制造环节纷纷外包给专业的半导体制造商。因此,对于半导体产品质量的管理也从原来传统的企业内部质量管理,转变成整个供应链的质量管理,对半导体产业的质量管理提出了新要求。 半导体产品种类众多、生产工艺复杂、合作协同程度要求高,其制造外包质量管理存在着一定的特殊性和较大的难度。其中,外包交接接口定义模糊、需求不清晰、缺乏信息反馈与持续改进机制等是目前质量管理中凸现的主要问题,尚缺乏有针对性的整体供应链质量管理模型。 本文在作者长期从事相关实践工作的基础上,运用全球供应链协会SCC提出的SCOR模型(Supply-Chain Operations Reference model,供应链运营参考模型)从整体供应链角度对半导体产业制造外包的质量管理作了探索性研究。首先,对半导体产业制造外包的基本模式及发展趋势作深入分析,以SCOR模型为框架结合半导体制造外包的质量管理需求与特点,阐述了质量管理的关键要求及薄弱环节,提出了基于SCOR的半导体制造外包质量管理方法。然后,通过对上述质量管理的流程体系、绩效指标及相关机制的进一步研究,从整体供应链角度构建了半导体制造外包的质量管理模型,并通过实际案例证明其运作的有效性和重要的应用价值。 本文共分以下六章:第一章为绪论,阐述了研究背景与选题意义、国内外研究现状及本文研究的内容;第二章分析了半导体制造外包发展趋势及现状;第三章提出了基于SCOR的半导体制造外包质量管理方法;第四章进一步构建了基于SCOR的半导体制造外包质量管理模型;第五章为案例与应用分析;第六章对本文的研究成果作了总结,并提出了未来研究工作的展望。 本文研究工作的主要创新性在于运用SCOR模型从整体供应链角度提出了半导体制造外包质量管理的新方法并构建了有效的质量管理模型,使得半导体相关企业之间能够准确地交流供应链质量问题、客观地评价质量管理绩效并形成了持续改进质量的新机制,为解决半导体产业质量管理中目前存在的主要问题提供了重要的参考。
[Abstract]:Semiconductor industry is an important foundation of modern information products production and manufacturing, and has been widely used in various industries. In the early days, the operation mode of semiconductor industry was that the production enterprises were responsible for product design, manufacturing and marketing, which could effectively control the quality of products within the enterprises. With the further development of semiconductor industry and the continuous expansion of industrial scale, affected by the pressure of cost competition, the optimization of resource integration and the trend of industrial subdivision, the industrial structure of semiconductor industry has changed from vertical integration to horizontal dispersion. Manufacturing links have been outsourced to professional semiconductor manufacturers. Therefore, the quality management of semiconductor products has changed from the traditional internal quality management of enterprises to the quality management of the whole supply chain, which puts forward new requirements for the quality management of semiconductor industry. There are many kinds of semiconductor products, the production process is complex, and the degree of cooperation and cooperation is high. The quality management of manufacturing outsourcing has its own particularity and great difficulty. Among them, vague definition of outsourcing interface, unclear requirements, lack of information feedback and continuous improvement mechanism are the main problems in current quality management, and there is still a lack of targeted overall supply chain quality management model. On the basis of the author's long-term practice, In this paper, the supply chain Operations reference Model (SCOR) proposed by the Global supply chain Association (SCC) is used to study the quality management of semiconductor manufacturing outsourcing from the perspective of global supply chain. First of all, the basic mode and development trend of semiconductor manufacturing outsourcing are deeply analyzed, and the key requirements and weak links of quality management are expounded based on the SCOR model and the quality management requirements and characteristics of semiconductor manufacturing outsourcing. The quality management method of semiconductor manufacturing outsourcing based on SCOR is proposed. Then, through the further study of the process system, performance indicators and related mechanisms of the above quality management, the quality management model of semiconductor manufacturing outsourcing is constructed from the perspective of the whole supply chain. The effectiveness of its operation and its important application value are proved by practical cases. This paper is divided into the following six chapters: the first chapter is the introduction, elaborated the research background and topic selection significance, the domestic and foreign research present situation and this article research content, the second chapter has analyzed the semiconductor manufacturing outsourcing development tendency and the present situation; The third chapter puts forward the semiconductor manufacturing outsourcing quality management method based on SCOR, the fourth chapter further constructs the SCOR-based semiconductor manufacturing outsourcing quality management model, the fifth chapter is the case and application analysis; Chapter six summarizes the research results of this paper and puts forward the prospect of future research work. The main innovation of this paper is to use SCOR model to put forward a new method of semiconductor manufacturing outsourcing quality management from the point of view of the whole supply chain and to construct an effective quality management model. It enables semiconductor-related enterprises to communicate supply chain quality problems accurately, evaluate quality management performance objectively and form a new mechanism for continuous improvement of quality. It provides an important reference for solving the main problems existing in the semiconductor industry quality management.
【学位授予单位】:复旦大学
【学位级别】:硕士
【学位授予年份】:2013
【分类号】:F426.63

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相关期刊论文 前1条

1 柴跃廷,韩坚,吴澄;敏捷供需链及其管理[J];中国机械工程;2000年03期



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