旋锻法制备WCu合金线材的工艺研究

发布时间：2018-01-18 14:41

本文关键词：旋锻法制备WCu合金线材的工艺研究　出处：《西安理工大学》2010年硕士论文　论文类型：学位论文

【摘要】： 针对WCu假合金组元间熔点相差较大、体积含量相当、彼此又难于形成中间相等特点,采用常规的拉拔、挤压、锻造等工艺难以获得线材的现状。本文采用松装熔渗的方法获得了大长径比WCu合金坯材,并通过旋锻将其加工成直径4mm的线材。研究中通过电子扫描、X射线衍射等手段分析研究了不同温度、不同变形量WCu合金线材的显微组织和物理性能等,并在实验中完善了WCu合金旋锻加工的工艺。结果表明： 1.采用热旋锻技术可以制备钨铜合金线材,其最佳的旋锻工艺是坯材旋锻初始温度为700-750℃,坯材变形量在达到25%之前,每组锻模的加工量为0.4mm；变形量超过25%之后,每组锻模的加工量为0.3mm。 2.利用本文开发的旋锻工艺,可制备出直径为4mm、长度为800mm、相对密度为98.16%、硬度为252HV、电导率为39.2%IACS,组织均匀、表面光洁的WCu25合金线材。 3.长径比大于50的WCu25坯材是通过松装熔渗法获得的。其过程是称取一定量粒度组成的钨铜混合粉末,装入石墨模具中,加适当压力使得粉末之间接触紧密,加足够的补充铜块放入烧结炉中于1350℃下,H2气氛中进行熔渗烧结获得。 4.在一定的变形量范围内,旋锻可以有效的提高组织均匀性,细化晶粒,消除WCu合金中的Cu富集以及孔洞等缺陷,当变形量达到30%-40%时,可以使铜相在合金内部形成细密、连贯的网络状结构。WCu线材的电导率在各个旋锻温度下随着变形量的变化都是先升高后降低。WCu线材的强度随着变形量的增大而提高。变形量在0-30%范围内,延伸率随着变形量的增加而减小；变形量超过30%后,延伸率变化不大；在750℃下,变形量达到50%时,WCu25线材的抗拉强度达到601MPa。
[Abstract]:For the WCu alloy component is much larger than the melting point, volume fraction, and it is difficult to form an intermediate equal each other, using conventional drawing, extrusion, forging and other processes is difficult to obtain the status of wire. In this paper, the ratio of length to diameter of WCu alloy billet with UNTAMPED infiltration, and processing the diameter 4mm wire by rotary forging. Research by electronic scanning, X ray diffraction analysis methods of different temperature and different deformation of WCu alloy wire on Microstructure and physical properties of WCu alloy, and improve the swaging process in the experiment. The results showed that:
1., the hot rotary forging technology can be used to prepare tungsten copper alloy wire. The best forging process is that the initial temperature of the forged material is 700-750 degrees, and the deformation of the blank reaches 25%. The processing volume of each forging die is 0.4mm. After the deformation is over 25%, the processing volume of each forging die is 0.3mm..
2., using the rotary forging process developed in this paper, we can prepare WCu25 alloy wire with a diameter of 4mm, a length of 800mm, a relative density of 98.16%, a hardness of 252HV, a conductivity of 39.2%IACS, a uniform structure and a smooth surface.
3. the diameter greater than 50 WCu25 billet by loose infiltration method. The process is called mixed tungsten copper powder take a certain amount of grain size composition, in graphite mold, with appropriate pressure to make close contact with powder, add enough copper pieces into the sintering furnace to below 1350 DEG C. H2 atmosphere in sintering.
4. in the amount of deformation within a certain range of rotary forging can effectively improve the uniformity of microstructure, grain refinement, elimination of WCu alloy Cu enrichment and defects such as holes, when the deformation rate reaches 30%-40%, the copper phase in the alloy can form fine conductivity, network structure of.WCu line coherence material in various spin forging temperature changes with the amount of deformation is increased at first and then increased with the increase of deformation decreases.WCu wire strength. The deformation in the range of 0-30%, the elongation decreases with the increase of deformation; deformation is more than 30%, little change in elongation; under 750 degrees, deformation amount to 50% the tensile strength of WCu25 wire, reached 601MPa.

【学位授予单位】：西安理工大学
【学位级别】：硕士
【学位授予年份】：2010
【分类号】：TG316

【引证文献】