高速压制法制备W-15Cu合金工艺的研究

发布时间：2018-06-23 16:07

  本文选题：W-Cu复合材料 + 细颗粒钨粉　； 参考：《中南大学》2010年硕士论文

【摘要】： 钨铜合金结合了钨的低膨胀性和铜的高热导性能,是一种具有优良的导热性能和可调节的热膨胀系数的电子封装复合材料。目前钨铜合金的生产主要采用熔渗法。而在熔渗法制备W85-Cu合金的过程中,采用细钨粉制备的钨铜合金与采用粗粒度钨粉制备的钨铜合金相比组织更均匀,产品性能也更好,目前国外生产钨铜复合材料一般采用细钨粉作为原料。但以细钨粉为原料,采用传统压型工艺很难得到相对密度达到72.40%的细钨粉骨架,因而得不到成分为W85-Cu的合金。本实验中采用高速压制技术(HVC)成功获得相对密度达到72.40%的细钨粉骨架,再通过熔渗工艺制备出高性能的细粉W85-Cu合金,并在熔渗后采用锻造的方法进一步提高钨铜合金的密度。本论文研究内容主要包括钨粉末直接高速压制工艺的研究,钨预成型坯高速压制工艺的研究,钨铜合金热锻工艺的研究,并借助各种实验手段对材料的组织和性能进行了分析,主要结论如下： 1)在掺入一定量的SBP胶之后,采用粉末直接高速压制可以得到钨高速压制坯,钨粉粒度越粗、钨粉的能量密度越高,所得到的钨高速压制坯的密度也越高； 2)通过钨预成型坯的高速压制得到的压坯密度与粉末粒度、预成型坯密度、压制温度以及能量密度有关：粉末粒度越粗、预成型坯密度越高、压制温度越高、能量密度越大,所得到的钨高速压制坯密度越高。 3)通过热锻可以进一步提高细钨粉钨铜合金的密度,热锻温度越高,合金的密度提高越大,对于近致密钨铜合金,多次热锻密度提高不明显。 4)通过限位在950℃时对钨预成型坯进行高速压制可以获得相对密度为72.40%的细钨粉骨架,经熔渗后可以得到相对密度达到99%以上的W85-Cu复合材料；热导为177W/(m·K),热膨胀系数(150℃)为6.9×10-6/K,气密性指标(He吸附)为1.0x10-9Pa·m3·s-1,各项性能都达到相应热沉材料的要求。
[Abstract]:Tungsten copper alloy is a kind of electronic packaging composite with excellent thermal conductivity and adjustable thermal expansion coefficient, which combines the low expansion property of tungsten with the high thermal conductivity of copper. At present, the production of tungsten-copper alloy mainly adopts infiltration method. However, in the process of preparing W85-Cu alloy by infiltration, the microstructure and properties of W85-Cu alloy prepared by fine tungsten powder are more uniform than those prepared by coarse-grained tungsten powder. At present, tungsten powder is generally used as raw material in the production of tungsten-copper composites abroad. However, it is difficult to obtain the skeleton of tungsten powder with relative density of 72.40% by traditional pressing technology, so the alloy containing W85-Cu can not be obtained. In this experiment, the high speed pressing technique (HVC) was used to obtain the fine tungsten powder skeleton with relative density of 72.40%, and then the high performance fine powder W85-Cu alloy was prepared by infiltration process, and the density of tungsten and copper alloy was further improved by forging after infiltration. This paper mainly includes the research of direct high speed pressing technology of tungsten powder, the study of high speed pressing technology of tungsten preformed billet, the research of hot forging technology of tungsten copper alloy, and the analysis of the microstructure and properties of the material by various experimental means. The main conclusions are as follows: 1) the higher the particle size of tungsten powder, the higher the energy density of tungsten powder. The density of high speed pressed tungsten billet is also higher. 2) the density of compacted billet and powder particle size obtained by high speed compaction of preformed tungsten billet, the density of preformed billet, Compacting temperature and energy density are related: the coarser the powder size, the higher the preform density, the higher the pressing temperature, the higher the energy density, The density of tungsten high speed pressed billet is higher. 3) the density of tungsten powder tungsten copper alloy can be further increased by hot forging. The higher the hot forging temperature, the higher the density of alloy, for the near dense tungsten copper alloy, The density of tungsten powder is not obviously increased by multiple hot forging. 4) the skeleton of fine tungsten powder with relative density of 72.40% can be obtained by pressing tungsten preformed at 950 鈩，

本文编号：2057686