气相法制备超细锡基无铅焊料粉体的研究

发布时间：2018-04-18 00:21

本文选题：无铅焊料 + 纳米粉体　；参考：《昆明理工大学》2010年硕士论文

【摘要】：锡基无铅焊料是目前替代含铅焊料的理想材料,随着电子工业的迅速发展,高性能锡基导电胶、焊膏,特别是纳米级焊剂的开发研究已成为电子封装、电子器件领域的重大课题。超细锡基无铅焊料粉体作为导电胶以及焊膏等助焊剂的配置原材料,其品质和产量已经成为这一领域的关键问题。本课题研究了等离子法制备Sn-Zn-Bi无铅焊料合金粉体。目前,制备超细金属粉体的方法有多种,本课题基于制粉过程的实用性和经济性考虑,始终着眼于以实现工业化生产为目的,从粉体的形成机理、使用的功能性、工艺流程的简便和可控性几个方面出发,系统研究了制备过程中的各种影响因素。着重讨论了粉体粒径、形貌的影响关系以及等离子电弧法中电流强度、Ar流量等参数对粉体的产率、形貌、粒径的影响规律,并对试验结果进行讨论,优化工艺参数,进行了综合的试验研究。本实验首先对Sn、Zn、Bi三种纯金属粉体的制备技术进行了研究,从实验中总结出等离子法制备超细金属粉体的最优工艺方法和技术参数。在此实验基础上进一步用等离子法制备比较复杂的合金焊料粉体。此时,不但要保证粉体的纯度,性能等前期制粉要求,还要解决合金分馏这一关键性技术问题。至此,本实验提出了具有创新意义的解决方案。采用定时定量的给料方式,使被气化的合金在最小热容量范围内,从而保证了被气化金属具有较高的蒸发速率和挥发性,以此实现给料量与气化量的协同一致,强化了气化效率和防止了合金的分馏。对于实验样品,运用X射线衍射(XRD),透射电镜(TEM),差热-分析(DSC)等现代检测手段对粉体进行表征。测试结果表明：在Ar流量为12L/min,给料量为5g/min,压差为2100mm,电流强度为260A时所制得的超细无铅焊料粉末分散性较好、粒径分布均匀,在100nm左右,纯度高,并且未发生明显的偏析现象。整个实验结果表明：等离子法制粉中,特殊的给料方式,实现了反应室内的连续反应,连续制粉,且在制备合金(复合)粉末时,不会产生金属的分馏及偏析问题,一步反应便可以收集到成品焊料粉体,为工业气化法制备提供了一条崭新的途径。
[Abstract]:Tin based lead-free solder is an ideal material to replace lead solder. With the rapid development of electronic industry, the development and research of high performance tin based conductive adhesive, solder paste, especially nanometer flux has become electronic packaging.Major issues in the field of electronic devices.Ultrafine tin based lead-free solder powder is the raw material of conductive adhesive and solder paste. Its quality and output have become the key problem in this field.The preparation of Sn-Zn-Bi lead-free solder powder by plasma method was studied in this paper.At present, there are many methods for preparing ultrafine metal powders. Based on the practical and economical considerations in the process of powder making, this subject has always focused on the purpose of realizing industrial production, from the mechanism of powder formation and the function of use.Based on the simplicity and controllability of the technological process, various factors affecting the preparation process were systematically studied.The influence of particle size and morphology, and the influence of current intensity and ar flow rate on the powder yield, morphology and particle size are discussed. The experimental results are discussed to optimize the process parameters.A comprehensive experimental study was carried out.In this experiment, the preparation technology of three kinds of pure metal powders, Sn-Zn-Zn-Bi, was studied, and the optimum technological method and technical parameters of preparing ultrafine metal powder by plasma method were summarized from the experiment.On the basis of this experiment, the more complex alloy solder powder was prepared by plasma method.In this case, not only the powder purity and properties should be guaranteed, but also the critical technical problem of alloy fractionation should be solved.So far, this experiment has put forward the innovative solution.By means of timing and quantitative feeding, the gasified alloy is in the range of minimum heat capacity, thus ensuring the high evaporation rate and volatility of the vaporized metal, thus realizing the coordination between the feed quantity and the gasification amount.The gasification efficiency is enhanced and the fractionation of the alloy is prevented.The powder was characterized by modern methods such as X-ray diffraction (XRD), transmission electron microscopy (TEM), differential thermal analysis (DTA) and DSC.The test results show that the ultrafine lead-free solder powder prepared at ar flow rate of 12 L / min, feed rate of 5 g / min, pressure difference of 2100mm and current strength of 260A has good dispersion, uniform particle size distribution, high purity around 100nm, and no obvious segregation.The results of the whole experiment show that the special feeding method in plasma powder can realize the continuous reaction in the reaction room and the continuous powder making, and when the alloy (composite) powder is prepared, the problem of metal fractionation and segregation will not occur.The finished solder powder can be collected by one step reaction, which provides a new way for industrial gasification.
【学位授予单位】：昆明理工大学
【学位级别】：硕士
【学位授予年份】：2010
【分类号】：TB383.1;TG42

【参考文献】